SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210028150A1

    公开(公告)日:2021-01-28

    申请号:US16523787

    申请日:2019-07-26

    Abstract: A semiconductor device package includes a substrate, a stacked structure and an encapsulation layer. The substrate includes a circuit layer, a first surface and a second surface opposite to the first surface. The substrate defines at least one cavity through the substrate. The stacked structure includes a first semiconductor die disposed on the first surface and electrically connected on the circuit layer, and at least one second semiconductor die stacked on the first semiconductor die and electrically connected to the first semiconductor die. The second semiconductor die is at least partially inserted into the cavity. The encapsulation layer is disposed in the cavity and at least entirely encapsulating the second semiconductor die.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220302004A1

    公开(公告)日:2022-09-22

    申请号:US17205967

    申请日:2021-03-18

    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface of the substrate. The substrate has a through opening extending between the first surface of the substrate and the second surface of the substrate. The semiconductor device package also includes a conductive pad in the through opening and approximal to the second surface of the substrate. The conductive pad has a first surface and a second surface opposite to the first surface of the conductive pad. The semiconductor device package also includes a conductive pillar in contact with the first surface of the conductive pad. The second surface of the conductive pad protrudes from the second surface of the substrate. A method of manufacturing a semiconductor device package is also disclosed.

    PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210327841A1

    公开(公告)日:2021-10-21

    申请号:US16854730

    申请日:2020-04-21

    Abstract: A package structure and a manufacturing method are provided. The package structure includes a first circuit layer, a first dielectric layer, an electrical device and a first conductive structure. The first circuit layer includes a first alignment portion. The first dielectric layer covers the first circuit layer. The electrical device is disposed on the first dielectric layer, and includes an electrical contact aligning with the first alignment portion. The first conductive structure extends through the first alignment portion, and electrically connects the electrical contact and the first alignment portion.

    SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS

    公开(公告)号:US20210225746A1

    公开(公告)日:2021-07-22

    申请号:US17221597

    申请日:2021-04-02

    Abstract: A semiconductor package includes a base material, a capture land, an interconnection structure, a semiconductor chip and an encapsulant. The base material has a top surface and an inner lateral surface. The capture land is disposed in or on the base material, and has an outer side surface. The interconnection structure is disposed along the inner lateral surface of the base material, and on the capture land. The interconnection structure has an outer side surface. An outer side surface of the semiconductor package includes the outer side surface of the capture land and the outer side surface of the interconnection structure. The semiconductor chip is disposed on the top surface of the base material. The encapsulant is disposed adjacent to the top surface of the base material, and covers the semiconductor chip.

    ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME

    公开(公告)号:US20230042800A1

    公开(公告)日:2023-02-09

    申请号:US17396604

    申请日:2021-08-06

    Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

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