公开(公告)号：US20140252595A1

公开(公告)日：2014-09-11

申请号：US13789382

申请日：2013-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/498

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73259 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括衬底，半导体芯片，封装体和天线层。 半导体芯片设置在基板上。 封装体封装半导体芯片并且包括上表面。 天线层形成在封装主体的上表面上并且包括连接在一起的两个天线插槽组。 每个天线槽组包括沿着第一方向延伸的波导槽和沿着第二方向延伸的照射槽群，其中照射槽组连接到波导槽。

公开(公告)号：US09978688B2

公开(公告)日：2018-05-22

申请号：US13781606

申请日：2013-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81 ,  H01L24/81

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

公开(公告)号：US09129954B2

公开(公告)日：2015-09-08

申请号：US13789382

申请日：2013-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L25/16 ,  H01L23/538

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73259 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括衬底，半导体芯片，封装体和天线层。 半导体芯片设置在基板上。 封装体封装半导体芯片并且包括上表面。 天线层形成在封装主体的上表面上并且包括连接在一起的两个天线插槽组。 每个天线槽组包括沿着第一方向延伸的波导槽和沿着第二方向延伸的照射槽群，其中照射槽组连接到波导槽。

公开(公告)号：US20140239465A1

公开(公告)日：2014-08-28

申请号：US13781606

申请日：2013-02-28

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81 ,  H01L24/81

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract translation: 半导体封装包括衬底，接地层，密封剂，屏蔽层和导电元件。 衬底包括芯片。 密封剂封装接地层和芯片，其中密封剂具有上表面。 屏蔽层形成在密封剂的上表面上。 导电元件围绕波导腔并延伸到接地层。 接地层，屏蔽层和导电元件一起形成波导天线。