公开(公告)号：US20080012045A1

公开(公告)日：2008-01-17

申请号：US11776393

申请日：2007-07-11

申请人： Akira Muto ,  Ichio Shimizu ,  Tetsuo Iljima ,  Toshiyuki Hata ,  Katsuo Ishizaka

发明人： Akira Muto ,  Ichio Shimizu ,  Tetsuo Iljima ,  Toshiyuki Hata ,  Katsuo Ishizaka

IPC分类号： H01L31/111 ,  H01L21/00

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is provided, which is capable of improving mounting flexibility relatively and increasing general versatility, as well as realizing heat radiation characteristics and low on-resistance. Moreover, the semiconductor device is provided, which is capable of improving reliability, performing processing in manufacturing processes easily and reducing manufacturing costs. Also, the semiconductor device capable of decreasing the mounting area is provided. A semiconductor chip in which an IGBT is formed and a semiconductor chip in which a diode is formed are mounted over a die pad. Then, the semiconductor chip and the semiconductor chip are connected by using a clip. The clip is arranged so as not to overlap with bonding pads formed at the semiconductor chip in a flat state. The bonding pads formed at the semiconductor chip are connected to electrodes by using wires.

摘要翻译： 提供了一种半导体器件，其能够相对地提高安装灵活性并增加通用性，并且实现热辐射特性和低导通电阻。 此外，提供了能够提高可靠性，容易地进行制造工艺的处理并降低制造成本的半导体器件。 此外，还提供了能够减小安装面积的半导体器件。 其中形成IGBT的半导体芯片和其中形成有二极管的半导体芯片安装在管芯焊盘上。 然后，使用夹子连接半导体芯片和半导体芯片。 夹子被布置成不与形成在半导体芯片处的平坦状态的接合焊盘重叠。 通过使用导线将形成在半导体芯片上的接合焊盘连接到电极。

公开(公告)号：US08138600B2

公开(公告)日：2012-03-20

申请号：US11776393

申请日：2007-07-11

申请人： Akira Muto ,  Ichio Shimizu ,  Tetsuo Iljima ,  Toshiyuki Hata ,  Katsuo Ishizaka

发明人： Akira Muto ,  Ichio Shimizu ,  Tetsuo Iljima ,  Toshiyuki Hata ,  Katsuo Ishizaka

IPC分类号： H01L23/34

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is provided, which is capable of improving mounting flexibility relatively and increasing general versatility, as well as realizing heat radiation characteristics and low on-resistance. Moreover, the semiconductor device is provided, which is capable of improving reliability, performing processing in manufacturing processes easily and reducing manufacturing costs. Also, the semiconductor device capable of decreasing the mounting area is provided. A semiconductor chip in which an IGBT is formed and a semiconductor chip in which a diode is formed are mounted over a die pad. Then, the semiconductor chip and the semiconductor chip are connected by using a clip. The clip is arranged so as not to overlap with bonding pads formed at the semiconductor chip in a flat state. The bonding pads formed at the semiconductor chip are connected to electrodes by using wires.

摘要翻译： 提供了一种半导体器件，其能够相对地提高安装灵活性并增加通用性，并且实现热辐射特性和低导通电阻。 此外，提供了能够提高可靠性，容易地进行制造工艺的处理并降低制造成本的半导体器件。 此外，还提供了能够减小安装面积的半导体器件。 其中形成IGBT的半导体芯片和其中形成有二极管的半导体芯片安装在管芯焊盘上。 然后，使用夹子连接半导体芯片和半导体芯片。 夹子被布置成不与形成在半导体芯片处的平坦状态的接合焊盘重叠。 通过使用导线将形成在半导体芯片上的接合焊盘连接到电极。