MECHANISM FOR SELECTIVE COUPLING IN MICROELECTROMECHANICAL SYSTEMS INERTIAL SENSORS

    公开(公告)号:US20210396520A1

    公开(公告)日:2021-12-23

    申请号:US16906484

    申请日:2020-06-19

    Abstract: Couplers for selectively coupling in-plane and out-of-plane motion between moving masses are provided herein. In particular, aspects of the present application provide for a coupler configured to couple in-plane motion between moving masses while decoupling out-of-plane motion between the moving masses. The selective couplers as described herein may be used in a device, such as a microelectromechanical systems (MEMS) inertial sensor. In some embodiments, a MEMS inertial sensor comprises a first mass configured to move in-plane, a second mass configured to move in-plane and out-of-plane, and a coupler coupling the first and second masses and comprising two levers coupled to an anchor point by respective tethers and coupled to each other by a spring.

    STRESS ISOLATION PROCESS
    4.
    发明公开

    公开(公告)号:US20240253979A1

    公开(公告)日:2024-08-01

    申请号:US18632802

    申请日:2024-04-11

    CPC classification number: B81C1/00325 B81B7/0048 B81C1/00063 B81B2203/01

    Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

    Mechanism for selective coupling in microelectromechanical systems inertial sensors

    公开(公告)号:US11519726B2

    公开(公告)日:2022-12-06

    申请号:US16906484

    申请日:2020-06-19

    Abstract: Couplers for selectively coupling in-plane and out-of-plane motion between moving masses are provided herein. In particular, aspects of the present application provide for a coupler configured to couple in-plane motion between moving masses while decoupling out-of-plane motion between the moving masses. The selective couplers as described herein may be used in a device, such as a microelectromechanical systems (MEMS) inertial sensor. In some embodiments, a MEMS inertial sensor comprises a first mass configured to move in-plane, a second mass configured to move in-plane and out-of-plane, and a coupler coupling the first and second masses and comprising two levers coupled to an anchor point by respective tethers and coupled to each other by a spring.

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