公开(公告)号：US11450469B2

公开(公告)日：2022-09-20

申请号：US16553954

申请日：2019-08-28

Applicant: Analog Devices Global Unlimited Company

Inventor： Paul Lambkin ,  Patrick J. Murphy ,  Bernard Patrick Stenson ,  Laurence B. O'Sullivan ,  Stephen O'Brien ,  Shane Geary ,  Baoxing Chen ,  Sombel Diaham

IPC: H01F19/08 ,  H04B1/04 ,  H04B1/16 ,  H01G2/00

Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

公开(公告)号：US09887687B2

公开(公告)日：2018-02-06

申请号：US14608072

申请日：2015-01-28

Applicant: Analog Devices Global

Inventor： Seamus Paul Whiston ,  Bernard Patrick Stenson ,  Michael Noel Morrissey ,  Michael John Flynn

IPC: H05K3/30 ,  H05K1/18 ,  H03H9/17 ,  H03H9/46 ,  H03H9/22 ,  H03H9/15 ,  H03H9/24 ,  H03H9/02

CPC classification number: H03H9/462 ,  H01L2224/48227 ,  H03H9/174 ,  H03H9/22 ,  H03H2009/02165 ,  H03H2009/155 ,  H03H2009/2421

Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.

公开(公告)号：US09478359B2

公开(公告)日：2016-10-25

申请号：US14102132

申请日：2013-12-10

Applicant: ANALOG DEVICES GLOBAL

Inventor： Bernard Patrick Stenson ,  Paul Martin Lambkin ,  Colette J. Blaney ,  John Beatty

IPC: H01G4/33 ,  H01C17/242 ,  H01G4/255 ,  H01C7/00

CPC classification number: H01G4/33 ,  H01C7/006 ,  H01C17/242 ,  H01G4/255

Abstract: A phase corrector for laser trimming a component, the phase corrector comprising: a first correction structure located to a first side of the component, the first correction structure comprising first and second correction regions at first and second distances from the component; and a second correction structure located to a second side the component, the second correction structure comprising third and fourth correction regions at third and fourth distances from the component.

公开(公告)号：US12080460B2

公开(公告)日：2024-09-03

申请号：US17890163

申请日：2022-08-17

Applicant: Analog Devices Global Unlimited Company

Inventor： Paul Lambkin ,  Patrick J. Murphy ,  Bernard Patrick Stenson ,  Laurence B. O'Sullivan ,  Stephen O'Brien ,  Shane Geary ,  Baoxing Chen ,  Sombel Diaham

IPC: H01F19/08 ,  H01G2/00 ,  H04B1/04 ,  H04B1/16

CPC classification number: H01F19/08 ,  H01F2019/085 ,  H01G2/00 ,  H04B1/04 ,  H04B1/16

Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

公开(公告)号：US20210065955A1

公开(公告)日：2021-03-04

申请号：US16553954

申请日：2019-08-28

Applicant: Analog Devices Global Unlimited Company

Inventor： Paul Lambkin ,  Patrick J. Murphy ,  Bernard Patrick Stenson ,  Laurence B. O'Sullivan ,  Stephen O'Brien ,  Shane Geary ,  Baoxing Chen ,  Sombel Diaham

IPC: H01F19/08

Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

公开(公告)号：US20200076512A1

公开(公告)日：2020-03-05

申请号：US16287796

申请日：2019-02-27

Applicant: Analog Devices Global Unlimited Company

Inventor： Laurence B. O'Sullivan ,  Shane Geary ,  Baoxing Chen ,  Bernard Patrick Stenson ,  Paul Lambkin ,  Patrick M. McGuinness ,  Stephen O'Brien ,  Patrick J. Murphy

IPC: H04B10/80 ,  H01F27/28

Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.

公开(公告)号：US20180358166A1

公开(公告)日：2018-12-13

申请号：US16003621

申请日：2018-06-08

Applicant: Analog Devices Global Unlimited Company

Inventor： Jan Kubik ,  Bernard Patrick Stenson ,  Michael Morrissey

IPC: H01F27/26 ,  H01F27/28

CPC classification number: H01F27/263 ,  H01F27/2804 ,  H01F2027/2809 ,  H01F2027/2819

Abstract: Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.

公开(公告)号：US20180061569A1

公开(公告)日：2018-03-01

申请号：US15248775

申请日：2016-08-26

Applicant: Analog Devices Global

Inventor： Jan Kubík ,  Bernard Patrick Stenson ,  Shane Patrick Geary ,  Michael Noel Morrissey

IPC: H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F1/03

CPC classification number: H01F41/041 ,  H01F1/0315 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/046 ,  H01F2027/2809 ,  H01F2027/2819

Abstract: The disclosure relates to the manufacture of inductive components, in particular transformers, using a combination of microfabrication techniques and discrete component placement. By using a prefabricated core, the core may be made much thicker than one that is deposited using microfabrication techniques. As such, saturation occurs later and the efficiency of the transformer is improved. This is done at a much lower cost than the cost of producing a thicker core by depositing multiple layers using microfabrication techniques.

公开(公告)号：US11044022B2

公开(公告)日：2021-06-22

申请号：US16287796

申请日：2019-02-27

Applicant: Analog Devices Global Unlimited Company

Inventor： Laurence B. O'Sullivan ,  Shane Geary ,  Baoxing Chen ,  Bernard Patrick Stenson ,  Paul Lambkin ,  Patrick M. McGuinness ,  Stephen O'Brien ,  Patrick J. Murphy

IPC: H04B10/80 ,  H01F27/28

Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.

公开(公告)号：US10290532B2

公开(公告)日：2019-05-14

申请号：US15600664

申请日：2017-05-19

Applicant: Analog Devices Global

Inventor： Alan John Blennerhassett ,  Bernard Patrick Stenson

IPC: H01L21/76 ,  H01L21/768 ,  H01L21/8238 ,  H01L23/522 ,  H01L23/528 ,  H01L21/8234 ,  H01L23/64 ,  H01F17/00 ,  H01L29/06 ,  H01G4/06

Abstract: Integrated digital isolators comprise a first transformer coil or capacitor plate mounted on an integrated circuit substrate, and separated from a second transformer coil or capacitor plate via an electrically insulating isolation layer. The electrical isolation that is achieved is dependent upon the material and thickness of the isolation layer. In order to reduce the amount of time required for fabrication while still allowing thick isolation layers to be deployed, in examples of the disclosure pre-formed sheets or tapes of dielectric material are applied to the substrate over the first transformer coil or capacitive plate, for example by being rolled onto the substrate using a heated roller. Such a technique results in a thick isolation layer that is formed using a simple process and much more quickly and reliably than conventional spin-coating or deposition techniques.