Abstract:
This application relates to ring-shaped adhesives for use during the manufacturing of a portable electronic device. The portable electronic device can have a small form factor, such as being a tablet computer or a mobile phone. A printable adhesive is dispensed on a release liner in a shape that conforms with a surface of the portable electronic device. The shape of the printable adhesive follows a path characterized by a continuous closed curve and encloses an area on the release liner without printable adhesive dispensed therein. The width of the printable adhesive along the continuous closed curve can vary to conform to features in one or more surfaces of the portable electronic device. The features can have dimensions of less than one millimeter. The printable adhesive can be can be applied to the release liner by a screen printing process or by dispensing the printable adhesive through a nozzle.
Abstract:
An electronic device having a securing member for a camera module is disclosed. The securing member may include several flexible spring elements extending around the camera module to maintain the position of the camera module during an assembly process of the electronic device. The securing member and the housing may be made from an electrically conductive material or materials. In this manner, the securing member may further provide the camera module with an electrical ground to prevent excessive electric charge within the camera module. In some embodiments, an alignment member is positioned on the housing and aligns the camera module and/or securing member with an aperture of the housing.
Abstract:
This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.
Abstract:
An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.
Abstract:
The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.
Abstract:
This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
Abstract:
A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
Abstract:
This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.