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公开(公告)号:US11738517B2
公开(公告)日:2023-08-29
申请号:US17343573
申请日:2021-06-09
Applicant: Applied Materials, Inc.
Inventor: Igor Abramson , Mo Yang , Jason G. Fung , Douglas Kitajima
IPC: B33Y10/00 , B33Y50/02 , B29C64/112 , B29C64/393 , G01B11/27 , B33Y30/00 , B29C64/264 , B24D11/00
CPC classification number: B29C64/393 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y50/02 , G01B11/272 , B24D11/003 , B29C64/264
Abstract: Embodiments of the present disclosure generally relate to droplet ejecting additive manufacturing systems used in the manufacturing of advanced polishing articles. In particular, embodiments herein provide methods for aligning a plurality of dispense heads of the additive manufacturing system. In one embodiment, a method for aligning a plurality of dispense heads of an additive manufacturing system includes forming an alignment test pattern comprising droplets dispensed from each of the plurality of dispense heads, comparing the placement of one or more of the droplets to determine offset distances therebetween, and generating one or more timing offsets based on the offset distances. In some embodiments, the method further includes using the timing offsets to control the dispensing of droplets from one or more of the plurality of dispense heads in a subsequent additive manufacturing process.
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公开(公告)号:US11685014B2
公开(公告)日:2023-06-27
申请号:US16529884
申请日:2019-08-02
Applicant: Applied Materials, Inc.
Inventor: Sivapackia Ganapathiappan , Ankit Vora , Boyi Fu , Venkat Hariharan , Mayu Yamamura , Mario Cornejo , Igor Abramson , Mo Yang , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L31/00 , B33Y80/00
CPC classification number: B24B37/24 , B29C64/112 , B33Y10/00 , B33Y70/10 , C08F283/008 , B29L2031/736 , B33Y80/00
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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