公开(公告)号：US20160282886A1

公开(公告)日：2016-09-29

申请号：US14722327

申请日：2015-05-27

Applicant: Applied Materials, Inc.

Inventor： Jamie Stuart LEIGHTON ,  Carlos CABALLERO ,  Shin KITAMURA ,  Thomas ACKERMAN ,  Mark AUZENNE ,  Vivek VINIT

IPC: G05D23/19 ,  G05B11/42

CPC classification number: G05D23/1919 ,  G05D23/27

Abstract: A method and apparatus for controlling the temperature in a processing chamber for semiconductor processing is disclosed herein. In one embodiment, a processing chamber for semiconductor processing is provided. The processing chamber includes a chamber body and a temperature control system. The temperature control system includes a temperature sensor configured to measure a temperature in an upper dome of the processing chamber, a blower, and a controller configured to control the temperature control system. The temperature control system is configured to carry out the method provided herein for controlling the temperature in a processing chamber.

Abstract translation: 本文公开了一种用于控制用于半导体处理的处理室中的温度的方法和装置。 在一个实施例中，提供了一种用于半导体处理的处理室。 处理室包括室主体和温度控制系统。 温度控制系统包括温度传感器，其被配置为测量处理室的上部圆顶中的温度，鼓风机和被配置为控制温度控制系统的控制器。 温度控制系统被配置为执行本文提供的用于控制处理室中的温度的方法。

公开(公告)号：US20200246935A1

公开(公告)日：2020-08-06

申请号：US16752181

申请日：2020-01-24

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Jamie Stuart LEIGHTON ,  Van H. NGUYEN ,  Roger M. JOHNSON

IPC: B24B37/015 ,  B24B49/14 ,  B24B49/08 ,  G05B11/42

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

公开(公告)号：US20240109164A1

公开(公告)日：2024-04-04

申请号：US17959076

申请日：2022-10-03

Applicant: Applied Materials, Inc.

Inventor： Chang ZHANG ,  Jian J. CHEN ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON

IPC: B24B49/16 ,  B24B37/30 ,  B24B49/12

CPC classification number: B24B49/16 ,  B24B37/30 ,  B24B49/12

Abstract: A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured to monitor the pressure system and produce a first output based on conditions detected in the pressure system. The control system coupled to the first sensor and configured to process the first output to produce a first processed output, and the control system configured to compare the first processed output to a threshold to detect a presence of a fluid in the pressure system.

公开(公告)号：US20220118583A1

公开(公告)日：2022-04-21

申请号：US17488429

申请日：2021-09-29

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Jamie Stuart LEIGHTON ,  Roger M. JOHNSON ,  Van H. NGUYEN

IPC: B24B37/04

Abstract: An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of a plurality of polishing stations, polishing the first substrate at the first polishing station, transferring the first substrate to a second polishing station, and transferring a second substrate to the first polishing station. The method includes cleaning a first surface of a plurality of surfaces of the polishing system by dispensing a first cleaning fluid from a first one or more nozzles of a plurality of nozzles to direct the first cleaning fluid onto the first surface and dispensing a second cleaning fluid from the first one or more nozzles to direct the second cleaning fluid onto the first surface, where the second cleaning fluid is different from the first cleaning fluid.

公开(公告)号：US20250010431A1

公开(公告)日：2025-01-09

申请号：US18274991

申请日：2022-08-18

Applicant: Applied Materials, Inc.

Inventor： Jianjun HU ,  Peng LIU ,  Colin John DICKINSON ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON ,  Gopalakrishna B. PRABHU ,  John Howard GIVENS

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/04

Abstract: The present disclosure generally relates to methods and system used to collect and reuse polishing fluids used during a chemical mechanical polishing (CMP) process for the fabrication of electronic devices. More specifically, systems and methods provided herein include a polishing fluid collection system having a catch basin, a vacuum device, and a polishing fluid recycling module for recycling polishing fluid.

公开(公告)号：US20220016739A1

公开(公告)日：2022-01-20

申请号：US17365848

申请日：2021-07-01

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Ashish BHUSHAN ,  Jamie Stuart LEIGHTON ,  John Anthony GARCIA ,  Stephen Thomas CORMIER ,  Nick Joseph JACKSON ,  Manoj BALAKUMAR ,  Nandkishore PATIDAR

IPC: B24B37/015

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.