公开(公告)号：US20240219337A1

公开(公告)日：2024-07-04

申请号：US18604257

申请日：2024-03-13

Applicant: Applied Materials, Inc.

Inventor： XIAOPU LI ,  KALLOL BERA ,  YAOLING PAN ,  KELVIN CHAN ,  AMIR BAYATI ,  PHILIP ALLAN KRAUS ,  KENRIC T. CHOI ,  WILLIAM JOHN DURAND

IPC: G01N27/22 ,  C23C16/455 ,  C23C16/52 ,  G01N33/00 ,  H01L21/67

CPC classification number: G01N27/22 ,  C23C16/45544 ,  C23C16/45561 ,  C23C16/52 ,  G01N33/0027 ,  H01L21/67017 ,  H01L21/67253

Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.

公开(公告)号：US20220341867A1

公开(公告)日：2022-10-27

申请号：US17861034

申请日：2022-07-08

Applicant: Applied Materials, Inc.

Inventor： YAOLING PAN ,  PATRICK JOHN TAE ,  LEONARD TEDESCHI ,  MICHAEL D. WILLWERTH ,  DANIEL THOMAS MCCORMICK

IPC: G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US20210033557A1

公开(公告)日：2021-02-04

申请号：US16526268

申请日：2019-07-30

Applicant: APPLIED MATERIALS, INC.

Inventor： PATRICK TAE ,  YAOLING PAN ,  LEONARD M. TEDESCHI

IPC: G01N27/22 ,  H01J37/32 ,  C23C16/46 ,  C23C16/04 ,  C23C16/52

Abstract: Methods and apparatus for a processing chamber are provided herein. The apparatus includes, for example, an inner volume defined in the processing chamber; a first sensor assembly coupled to a surface located in the inner volume of the processing chamber and including a first electrode configuration configured to measure an electrical characteristic associated with a film deposited within the inner volume of the processing chamber; and a second sensor assembly coupled to the surface located in the inner volume of the processing chamber in relative proximity to the first sensor assembly and including a second electrode configuration, different from the first electrode configuration, configured to measure the same electrical characteristic as the first electrode configuration.