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公开(公告)号:US20240219337A1
公开(公告)日:2024-07-04
申请号:US18604257
申请日:2024-03-13
Applicant: Applied Materials, Inc.
Inventor: XIAOPU LI , KALLOL BERA , YAOLING PAN , KELVIN CHAN , AMIR BAYATI , PHILIP ALLAN KRAUS , KENRIC T. CHOI , WILLIAM JOHN DURAND
IPC: G01N27/22 , C23C16/455 , C23C16/52 , G01N33/00 , H01L21/67
CPC classification number: G01N27/22 , C23C16/45544 , C23C16/45561 , C23C16/52 , G01N33/0027 , H01L21/67017 , H01L21/67253
Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.
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公开(公告)号:US20220341867A1
公开(公告)日:2022-10-27
申请号:US17861034
申请日:2022-07-08
Applicant: Applied Materials, Inc.
Inventor: YAOLING PAN , PATRICK JOHN TAE , LEONARD TEDESCHI , MICHAEL D. WILLWERTH , DANIEL THOMAS MCCORMICK
IPC: G01N27/22
Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
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3.
公开(公告)号:US20210033557A1
公开(公告)日:2021-02-04
申请号:US16526268
申请日:2019-07-30
Applicant: APPLIED MATERIALS, INC.
Inventor: PATRICK TAE , YAOLING PAN , LEONARD M. TEDESCHI
Abstract: Methods and apparatus for a processing chamber are provided herein. The apparatus includes, for example, an inner volume defined in the processing chamber; a first sensor assembly coupled to a surface located in the inner volume of the processing chamber and including a first electrode configuration configured to measure an electrical characteristic associated with a film deposited within the inner volume of the processing chamber; and a second sensor assembly coupled to the surface located in the inner volume of the processing chamber in relative proximity to the first sensor assembly and including a second electrode configuration, different from the first electrode configuration, configured to measure the same electrical characteristic as the first electrode configuration.
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