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公开(公告)号:US11926918B2
公开(公告)日:2024-03-12
申请号:US16468467
申请日:2017-12-19
Applicant: BASF SE
Inventor: Marcel Patrik Kienle , Dieter Mayer , Marco Arnold , Alexandra Haag , Charlotte Emnet , Alexander Fluegel
IPC: C25D3/32 , C25D3/02 , C25D3/38 , C25D7/12 , H01L21/288
CPC classification number: C25D3/32 , C25D3/02 , C25D3/38 , C25D7/123 , H01L21/2885
Abstract: The invention relates to a polyamine-based or polyhydric alcohol-based suppressing agent. The suppressing agent is modified by reaction with a compound that introduces a branching group into the suppressing agent before they are reacted with an alkylene oxide. The suppressing agent shows extraordinary superfilling properties, particularly when used to fill in features having extremely small aperture sizes and/or high aspect ratios.
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2.
公开(公告)号:US12134834B2
公开(公告)日:2024-11-05
申请号:US17995186
申请日:2021-03-24
Applicant: BASF SE
Inventor: Marco Arnold , Alexander Fluegel , Charlotte Emnet , Nadine Engelhardt
IPC: C25D3/38
Abstract: Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1 [A-B-A′-Z]n[Y—Z]m (L1) where B is a diacid fragment of formula L2 A, A′ are amine fragments independently selected from the group consisting of formula L3a and formula L3b Y is a co-monomer fragment; Z is a coupling fragment of formula L4 n is an integer of from 1 to 400; and m is 0 or an integer of from 1 to 400.
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3.
公开(公告)号:US12098473B2
公开(公告)日:2024-09-24
申请号:US17312737
申请日:2019-12-10
Applicant: BASF SE
Inventor: Sathana Kitayaporn , Charlotte Emnet , Dieter Mayer , Nadine Engelhardt , Marco Arnold , Lucas Benjamin Henderson , Alexander Fluegel
Abstract: Described herein is a composition including metal ions consisting essentially of cobalt ions, and a specific monomeric and polymeric suppressing agent including a carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groups which show a suppressing effect that is required for void-free bottom-up filling of nanometer-sized recessed features.
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公开(公告)号:US11840771B2
公开(公告)日:2023-12-12
申请号:US17566426
申请日:2021-12-30
Applicant: BASF SE
Inventor: Alexander Fluegel , Marco Arnold , Nadine Engelhardt , Marcel Patrik Kienle
Abstract: Described herein is an aqueous composition including tin ions and at least one compound of formula I
wherein
X1 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S or a C5 to C12 aromatic moiety,
R11 is a copolymer of ethylene oxide and a further C3 to C6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight,
R11 is selected from H, R11, R40,
R13, R14 are (a) independently selected from H, R11, R40, or (b) may together form a divalent group X13;
X13 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be
interrupted by O, S or NR43;
R40 is H or a linear or branched C1-C20 alkyl,
R43 is selected from H, R11 and a linear or branched C1-C20 alkyl.-
公开(公告)号:US20230203694A1
公开(公告)日:2023-06-29
申请号:US17564979
申请日:2021-12-29
Applicant: BASF SE
Inventor: Charlotte Emnet , Lucas Benjamin Henderson , Alexander Fluegel , Sathana Kitayaporn , Nadine Engelhardt
Abstract: Described herein is a composition for depositing copper on a semiconductor substrate, the composition including
(a) copper ions;
(b) a grain refiner of formula G1
or salts thereof
(c) a complexing agent; and
(d) optionally a buffer or a base capable of adjusting the pH to a pH of from 7 to 13;
where the variables are as defined herein; and
where the pH of the composition is from 7 to 13.-
公开(公告)号:US11459665B2
公开(公告)日:2022-10-04
申请号:US16954333
申请日:2018-12-10
Applicant: BASF SE
Inventor: Alexander Fluegel , Marco Arnold , Marcel Patrik Kienle , Nadine Engelhardt
Abstract: Described herein is an aqueous composition including tin ions and at least one compound of formula I where X1, X2 are independently selected from a linear or branched C1-C12 alkanediyl, R11 is a monovalent group of formula —(O—CH2—CHR41)m—OR42, R12, R13, R14 are independently selected from H, R11, and R40; R15 is selected from H, R11, R40 and —X4—N(R21)2, X4 is a divalent group selected from (a) a linear or branched C1 to C12 alkanediyl, and (b) formula —(O—CH2—CHR41)o—, R21 is selected from R11 and R40, R40 is a linear or branched C1-C20 alkyl, R41 is selected from H and a linear or branched C1 to C5 alkyl, R42 is selected from H and a linear or branched C1-C20 alkyl, n is an integer of from 1 to 6, m is an integer of from 2 to 250, and o is an integer of from 1 to 250.
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公开(公告)号:US11242606B2
公开(公告)日:2022-02-08
申请号:US17048770
申请日:2019-04-11
Applicant: BASF SE
Inventor: Alexander Fluegel , Marco Arnold , Nadine Engelhardt , Marcel Patrik Kienle
IPC: C25D3/32
Abstract: The present invention provides an aqueous composition comprising tin ions and at least one compound of formula I wherein X1 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S or a C5 to C12 aromatic moiety, R11 is a copolymer of ethylene oxide and a further C3 to C6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R12 is selected from H, R11, R40, R13, R14, are (a) independently selected from H, R11, R40, or (b) may together form a divalent group X13; X13 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O, S or NR43; R40 is H or a linear or branched C1-C20 alkyl, R43 is selected from H, R11 and a linear or branched C1-C20 alkyl.
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8.
公开(公告)号:US20220018035A1
公开(公告)日:2022-01-20
申请号:US17312737
申请日:2019-12-10
Applicant: BASF SE
Inventor: Sathana Katayaporn , Charlotte Emnet , Dieter Mayer , Nadine Engelhardt , Marco Arnold , Lucas Benjamin Henderson , Alexander Fluegel
Abstract: Described herein is a composition including metal ions consisting essentially of cobalt ions, and a specific monomeric and polymeric suppressing agent including a carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groups which show a suppressing effect that is required for void-free bottom-up filling of nanometer-sized recessed features.
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公开(公告)号:US20230203695A1
公开(公告)日:2023-06-29
申请号:US17565059
申请日:2021-12-29
Applicant: BASF SE
Inventor: Charlotte Emnet , Lucas Benjamin Henderson , Alexander Fluegel , Sathana Kitayaporn , Nadine Engelhardt
IPC: C25D3/38 , C25D7/12 , C25D5/02 , H01L21/768
CPC classification number: C25D3/38 , C25D7/123 , C25D5/02 , H01L21/76873 , H01L21/76879 , H01L23/53228
Abstract: Described herein is a composition for depositing copper on a semiconductor substrate, the composition including
(a) copper ions;
(b) an additive of formula S1
(c) a complexing agent; and
(d) optionally a buffer or base capable of adjusting the pH to a pH of from 7 to 13;
where the variables are as defined herein; and
where the pH of the composition is from 7 to 13 and where the composition is free of any cyanide.-
公开(公告)号:US11535946B2
公开(公告)日:2022-12-27
申请号:US16618222
申请日:2018-05-28
Applicant: BASF SE
Inventor: Alexander Fluegel , Jean-Pierre Berkan Lindner , Marco Arnold
Abstract: The present invention relates to the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for depositing tin alloy layer onto a substrate.
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