中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

14 records (took 0.015 seconds)

    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
    1.
    发明申请
    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT 有权

    公开(公告)号：US20220356592A1

    公开(公告)日：2022-11-10

    申请号：US17754110

    申请日：2020-09-15

    Applicant: BASF SE

    Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Nadine ENGELHARDT

    IPC: C25D5/00 ,  C25D5/16 ,  C25D7/12

    Abstract: Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C3 to C6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.

    COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING
    3.
    发明申请
    COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING 审中-公开

    公开(公告)号：US20190226107A1

    公开(公告)日：2019-07-25

    申请号：US16318540

    申请日：2017-07-06

    Applicant: BASF SE

    Inventor： Marcel Patrik KIENLE ,  Dieter MAYER ,  Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET

    IPC: C25D3/16 ,  C25D7/12 ,  C25D3/18 ,  H01L21/288 ,  H01L21/768 ,  H01L23/532 ,  H01L23/522

    Abstract: A composition comprising: (a) cobalt ions, and (b) an additive of formula (I) wherein R1 is selected from X-Y; R2 is selected from R1 and R3; X is selected from linear or branched C1 to C10 alkanediyl, linear or branched C2 to C10 alkenediyl, linear or branched C2 to C10 alkynediyl, and (C2H3R6—O)n—H; Y is selected from OR3, NR3R4, N+R3R4R5 and NH—(C═O)—R3; R3, R4, R5 are the same or different and are selected from (i) H, (ii) C5 to C20 aryl, (iii) C1 to C10 alkyl (iv) C6 to C20 arylalkyl, (v) C6 to C20 alkylaryl, which may be substituted by OH, SO3H, COOH or a combination thereof, and (vi) (C2H3R6—O)n—H, and wherein R3 and R4 may together form a ring system, which may be interrupted by O or NR7; m, n are integers independently selected from 1 to 30; R6 is selected from II and C1 to C5 alkyl; R7 is selected from R6 and formula (II).

    ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER
    7.
    发明申请
    ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER 有权

    公开(公告)号：US20250051949A1

    公开(公告)日：2025-02-13

    申请号：US18720906

    申请日：2022-12-20

    Applicant: BASF SE

    Inventor： Charlotte EMNET ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

    IPC: C25D3/38 ,  C25D5/00 ,  C25D7/12

    Abstract: Described herein is a composition for depositing copper on a semiconductor substrate, the composition including
    (a) copper ions;
    (b) a grain refiner of formula G1a or G1b or salts thereof; (c) a complexing agent; and
    (d) optionally a buffer or a base to adjust the pH to a pH of from 7 to 13;
    wherein
    RG1 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN;
    RG2 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN; and
    XG1 is selected from C1 to 6 alkanediyl or a group —XG11—C(O)—O—XG12—;
    XG11 is selected from a chemical bond or C1 to C4 alkandiyl;
    XG12 is selected from a chemical bond or C1 to C4 alkandiyl; and wherein RG1 or RG2, comprises at least one C1 to C4 carboxyl group, or group XG1 is —XG11—C(O)—O—)—XG12—; wherein the pH of the composition is from 7 to 13.

    Polyalkanolamines
    8.
    发明公开
    Polyalkanolamines 审中-公开

    公开(公告)号：US20230235471A1

    公开(公告)日：2023-07-27

    申请号：US18001078

    申请日：2021-06-07

    Applicant: BASF SE

    Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Nadine ENGELHARDT

    IPC: C25D3/38 ,  C08G73/02 ,  C08K3/08 ,  C08K5/3415 ,  C25D7/12

    CPC classification number: C25D3/38 ,  C08G73/024 ,  C08K3/08 ,  C08K5/3415 ,  C25D7/12 ,  C08K2003/085

    Abstract: Disclosed herein is a A polyalkanolamine including the structure of formula L1









    A
    L




    n






    B
    L




    m





    wherein

    AL is





    BL is




    -






    O-X


    L21





    o

    -,














    XL1, XL2, XL3 are independently selected from a C1 to C6 alkanediyl;
    ArL is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C1 to C6 alkyl;
    n is an integer of from 2 to 350;
    m is 0 or an integer of from 1 to 600;
    o is 1 or an integer of from 2 to 25;
    BL1 is a continuation of the backbone BL by branching;
    XL11, XL12, XL13 are independently selected from a C1 to C6 alkanediyl;
    XL21 is a C1 to C6 alkanediyl;

    and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
    9.
    发明申请
    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT 有权

    公开(公告)号：US20220333262A1

    公开(公告)日：2022-10-20

    申请号：US17754097

    申请日：2020-09-15

    Applicant: BASF SE

    Inventor： Nadine ENGELHARDT ,  Alexander FLUEGEL ,  Marco ARNOLD ,  Charlotte EMNET

    IPC: C25D1/00

    Abstract: Disclosed herein is a composition for copper bump electrodeposition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of from 900 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a C2 to C6 polyoxyalkylene group, and (c) the average number of oxyalkylene units in the polyoxyalkylene group is from more than 10 to less than 30 per N-hydrogen atoms in the polyalkyleneimine.

Patent Agency Ranking