HEAT PUMP DEVICE AND ASSEMBLY
    1.
    发明公开

    公开(公告)号:US20230152011A1

    公开(公告)日:2023-05-18

    申请号:US17989938

    申请日:2022-11-18

    Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

    METHOD AND COMPOSITION FOR QUANTIFYING PROTEIN USING TAGGED STANDARDS

    公开(公告)号:US20220178874A1

    公开(公告)日:2022-06-09

    申请号:US17544591

    申请日:2021-12-07

    Abstract: Methods and reference compositions for quantifying protein using tagged standards. In an exemplary method, a reference composition and a protein may be electrophoresed in respective lanes of a gel. The reference composition may include quantitation standards of different size and each including a tag present at a different concentration. The quantitation standards and the protein may be transferred from the gel to a solid support to create a blot. Luminescence may be detected from the blot to obtain respective luminescence values separately representing an abundance of the tag of each quantitation standard and an abundance of the protein. A quantity of the protein may be determined using the respective luminescence values.

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