Detecting apparatus
    4.
    发明授权

    公开(公告)号:US11964268B2

    公开(公告)日:2024-04-23

    申请号:US17576364

    申请日:2022-01-14

    Abstract: The present invention provides a detecting apparatus, including a storage chamber containing a treating fluid; wherein, the detecting apparatus is internally provided with a sharp-pointed portion; the storage chamber may make a movement relative to the sharp-pointed portion; the storage chamber will be pierced by the sharp-pointed portion during the moving process, such that the treating fluid in the storage chamber is released. The detecting apparatus further includes a collecting chamber; the released treating fluid may flow into the collecting chamber; the collecting chamber is disposed inside a first shell and used to contain a sample; an opening is disposed at an upper position of the first shell; the collecting chamber is internally provided with a testing element for detecting an analyte; the testing element is disposed on a carrier, and the carrier has a specific matching form with the collecting chamber. A buffer solution is disposed in an independent chamber of the detecting apparatus, and may be obtained at any time in need of detection and thus, is easy to be used. The carrier has a specific matching form with the collecting chamber in the first shell, such that the carrier has a definite and unique directional position after being inserted into the collecting chamber.

    HEAT PUMP DEVICE AND ASSEMBLY
    10.
    发明公开

    公开(公告)号:US20230152011A1

    公开(公告)日:2023-05-18

    申请号:US17989938

    申请日:2022-11-18

    Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Patent Agency Ranking