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公开(公告)号：US06506097B1
公开(公告)日：2003-01-14
申请号：US09764733
申请日：2001-01-16
申请人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
发明人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
摘要翻译： 一种用于两步抛光工艺的光学监视系统，其为多个径向区域中的每一个产生反射迹线。 当任何反射迹线表示金属层的初始间隙时，CMP设备可以从高选择性浆料切换到低选择性浆料，并且当所有反射迹线表示氧化物层已经完全暴露时，抛光可能停止。
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公开(公告)号：US06632124B2
公开(公告)日：2003-10-14
申请号：US10339959
申请日：2003-01-10
申请人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
发明人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
摘要翻译： 一种用于两步抛光工艺的光学监视系统，其为多个径向区域中的每一个产生反射迹线。 当任何反射迹线表示金属层的初始间隙时，CMP设备可以从高选择性浆料切换到低选择性浆料，并且当所有反射迹线表示氧化物层已经完全暴露时，抛光可能停止。
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公开(公告)号：US07101254B2
公开(公告)日：2006-09-05
申请号：US10966948
申请日：2004-10-15
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
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公开(公告)号：US06811466B1
公开(公告)日：2004-11-02
申请号：US10330685
申请日：2002-12-27
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译： 一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。 探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。 检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。 衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。 可以使用附加的探针。
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公开(公告)号：US07008295B2
公开(公告)日：2006-03-07
申请号：US10358852
申请日：2003-02-04
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/12
摘要： Methods and apparatus for monitoring a substrate surface during chemical mechanical polishing are disclosed.
摘要翻译： 公开了用于在化学机械抛光期间监测基底表面的方法和装置。
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公开(公告)号：US06832950B2
公开(公告)日：2004-12-21
申请号：US10282730
申请日：2002-10-28
IPC分类号： B24D1700
CPC分类号： B24B37/205 , B24B37/22 , B24B37/24 , Y10T428/28
摘要： Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. In embodiments, a polishing pad includes a backing layer having an opening, a polishing layer having an opening aligned with the opening in the backing layer, a solid window of a first material in the opening of the polishing layer, a layer of a first adhesive material between the backing layer and the solid window, and a layer of a second adhesive material between the layer of the first adhesive material and the window.
摘要翻译： 公开了具有窗的抛光垫，包含这种抛光垫的系统，以及使用这种抛光垫的工艺。 在实施例中，抛光垫包括具有开口的背衬层，具有与背衬层中的开口对准的开口的抛光层，在抛光层的开口中的第一材料的固体窗口，第一粘合剂层 背衬层和实心窗之间的材料，以及第一粘合材料层与窗之间的第二粘合材料层。
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公开(公告)号：US06716085B2
公开(公告)日：2004-04-06
申请号：US10035391
申请日：2001-12-28
IPC分类号： B24B4912
CPC分类号： B24B37/205
摘要： A polishing solution is dispensed onto a polishing pad that has a polishing surface, a substrate is brought into contact with the polishing surface, relative motion is created between the substrate and the polishing pad, a light beam is directed through a window in the polishing pad to impinge the substrate, and an intensity of a reflected light beam from the substrate is monitored. The polishing solution has a first refractive index, and the window has a second index of refraction that is approximately equal to the first index of refraction.
摘要翻译： 将抛光液分配到具有研磨面的研磨垫上，使基板与研磨面接触，在基板和研磨垫之间产生相对运动，将光束朝向抛光垫中的窗口 以撞击基板，并且监测来自基板的反射光束的强度。 抛光溶液具有第一折射率，并且窗口具有大致等于第一折射率的第二折射率。
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公开(公告)号：US06659842B2
公开(公告)日：2003-12-09
申请号：US09929903
申请日：2001-08-14
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G01B11/0683 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.
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9.发明授权公开(公告)号：US06296548B1
公开(公告)日：2001-10-02
申请号：US09591187
申请日：2000-06-08
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G01B11/0683 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.
摘要翻译： 一种装置以及方法使基板的表面与具有窗口的抛光垫接触，引起基板和抛光垫之间的相对运动，并引导光束通过窗口，使得运动 抛光垫相对于基底使得光束在穿过基底的路径中移动。 检测来自基板的光束反射，并用于确定抛光参数，检测过程重复性和限定工艺。
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10.发明授权Method and apparatus for determining polishing endpoint with multiple light sources 失效用多个光源确定抛光终点的方法和装置公开(公告)号：US06986699B2
公开(公告)日：2006-01-17
申请号：US09851661
申请日：2001-05-08
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B49/04
摘要： A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and a polishing head to hold a substrate against the polishing pad during processing. The substrate includes a thin film structure disposed on a wafer. A first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. A second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.
摘要翻译： 化学机械抛光装置包括用于支撑抛光垫的压板和用于在加工期间将衬底保持在抛光垫上的抛光头。 衬底包括设置在晶片上的薄膜结构。 第一光学系统包括产生撞击在基板的表面上的第一光束的第一光源和用于测量从基板的表面反射的光以产生测量的第一干涉信号的第一传感器。 第二光学系统包括第二光源，用于产生入射到衬底的表面上的第二光束;以及第二传感器，用于测量从衬底的表面反射的光，以产生测量的第二干涉信号。 第二光束具有与第一光束不同的波长。
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