公开(公告)号：US20180352668A1

公开(公告)日：2018-12-06

申请号：US15544630

申请日：2016-01-19

Applicant: CORNING INCORPORATED

Inventor： Jaymin Amin ,  Jaques Gollier ,  Shandon Dee Hart ,  Karl William Koch, III ,  Wageesha Senaratne

IPC: H05K5/02 ,  C03C3/091 ,  H05K5/00 ,  C03C15/00 ,  C03C19/00

CPC classification number: C09D5/00 ,  B24C1/00 ,  B24C1/04 ,  B24C3/322 ,  C03C3/083 ,  C03C3/091 ,  C03C15/00 ,  C03C21/002 ,  C03C2218/31 ,  G06F1/1656

Abstract: Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-finger print surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

公开(公告)号：US20220132690A1

公开(公告)日：2022-04-28

申请号：US17573694

申请日：2022-01-12

Applicant: CORNING INCORPORATED

Inventor： Jaymin Amin ,  Jaques Gollier ,  Shandon Dee Hart ,  Karl William Koch, III ,  Wageesha Senaratne

IPC: H05K5/02 ,  C03C3/091 ,  C03C15/00 ,  B24C3/32 ,  C09D5/00 ,  G06F1/16 ,  C03C3/083 ,  B24C1/04 ,  C03C21/00 ,  B24C1/00 ,  C03C19/00 ,  H05K5/00

Abstract: Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

公开(公告)号：US10522963B2

公开(公告)日：2019-12-31

申请号：US15689456

申请日：2017-08-29

Applicant: Corning Incorporated

Inventor： Lovell Eglin Comstock, II ,  Jaques Gollier ,  Thien An Thi Nguyen ,  Garrett Andrew Piech ,  Mark Ranney Westcott

IPC: B23K26/04 ,  B23K26/53 ,  H01S3/06 ,  H01S3/00 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/06 ,  B23K26/067 ,  B23K26/073 ,  C03B33/02 ,  B23K103/00

Abstract: A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.

公开(公告)号：US20180062342A1

公开(公告)日：2018-03-01

申请号：US15689456

申请日：2017-08-29

Applicant: Corning Incorporated

Inventor： Lovell Elgin Comstock, II ,  Jaques Gollier ,  Thien An Thi Nguyen ,  Garrett Andrew Piech ,  Mark Ranney Westcott

IPC: H01S3/00 ,  B23K26/00 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/064 ,  H01S3/06 ,  B23K26/067

Abstract: A method of laser processing a workpiece, the method comprising focusing a pulsed laser beam into a laser beam focal line directed into the workpiece, the laser beam focal line generating an induced absorption within the material, and the induced absorption producing a defect line along the laser beam focal line within the workpiece, wherein the focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and preferably by no more than 30 or 20% from its mean peak intensity.

公开(公告)号：US12052835B2

公开(公告)日：2024-07-30

申请号：US17573694

申请日：2022-01-12

Applicant: CORNING INCORPORATED

Inventor： Jaymin Amin ,  Jaques Gollier ,  Shandon Dee Hart ,  Karl William Koch, III ,  Wageesha Senaratne

IPC: H05K5/02 ,  B24C1/00 ,  B24C1/04 ,  B24C3/32 ,  C03C3/083 ,  C03C3/091 ,  C03C15/00 ,  C03C19/00 ,  C03C21/00 ,  C09D5/00 ,  G06F1/16 ,  H05K5/00

CPC classification number: H05K5/0217 ,  B24C1/00 ,  B24C1/04 ,  B24C3/322 ,  C03C3/083 ,  C03C3/091 ,  C03C15/00 ,  C03C19/00 ,  C03C21/002 ,  C09D5/00 ,  G06F1/1656 ,  H05K5/0086 ,  C03C2218/31

Abstract: Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

公开(公告)号：US11229131B2

公开(公告)日：2022-01-18

申请号：US15544630

申请日：2016-01-19

Applicant: CORNING INCORPORATED

Inventor： Jaymin Amin ,  Jaques Gollier ,  Shandon Dee Hart ,  Karl William Koch, III ,  Wageesha Senaratne

IPC: H05K5/02 ,  H05K5/00 ,  C03C3/091 ,  C03C15/00 ,  B24C3/32 ,  C09D5/00 ,  G06F1/16 ,  C03C3/083 ,  B24C1/04 ,  C03C21/00 ,  B24C1/00 ,  C03C19/00

Abstract: Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.