公开(公告)号：US09349929B2

公开(公告)日：2016-05-24

申请号：US13713410

申请日：2012-12-13

Applicant: CREE, Inc.

Inventor： Joseph G. Clark ,  Amber C. Abare ,  David T. Emerson ,  Jeremy S. Nevins ,  Raymond Rosado ,  Michael Bergmann

IPC: H01L33/58 ,  F21V21/00 ,  H01L33/50 ,  F21V7/00 ,  H01L25/075 ,  H01L33/54 ,  F21K99/00 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H01L33/58 ,  F21K9/233 ,  F21V7/00 ,  F21V21/00 ,  F21Y2105/18 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。

公开(公告)号：US20150048393A1

公开(公告)日：2015-02-19

申请号：US14531350

申请日：2014-11-03

Applicant: CREE, INC

Inventor： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Abstract translation: 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

公开(公告)号：USD749051S1

公开(公告)日：2016-02-09

申请号：US29439629

申请日：2012-12-13

Applicant: CREE, Inc.

Designer： Joseph G Clark ,  Amber C Abare ,  David T Emerson ,  Jeremy S Nevins ,  Raymond Rosado

公开(公告)号：US20130322070A1

公开(公告)日：2013-12-05

申请号：US13713410

申请日：2012-12-13

Applicant: CREE, INC.

Inventor： Joseph G. Clark ,  Amber C. Abare ,  David T. Emerson ,  Jeremy S. Nevins ,  Raymond Rosado

IPC: H01L33/58 ,  H01L33/50 ,  F21V7/00 ,  F21V21/00

CPC classification number: H01L33/58 ,  F21K9/233 ,  F21V7/00 ,  F21V21/00 ,  F21Y2105/18 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。