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公开(公告)号：US10912218B1
公开(公告)日：2021-02-02
申请号：US16571588
申请日：2019-09-16
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mehmet Onder Cap , Marc Henry Mantelli , Giridharan Rajagopalan , M. Baris Dogruoz , Robert Gregory Twiss , Joel Richard Goergen
IPC: H05K5/03 , H05K7/14 , H05K5/02 , H01R13/453 , H01R12/71 , H01R12/70 , H01R13/52 , H01R13/447
Abstract: In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.
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公开(公告)号：US10216249B2
公开(公告)日：2019-02-26
申请号：US15277560
申请日：2016-09-27
Applicant: Cisco Technology, Inc.
Abstract: A fault processing subsystem of an electronics assembly, senses an alarm state at an output of a first power distribution element of multiple power distribution elements arranged in a hierarchy in the electronics assembly. The first element is at a level of the hierarchy other than the top level, and the alarm state corresponds to an output of the first element being different than an expected output of that element. The fault processing subsystem commands, in response to the sensing the alarm state, the first element to disable via a control input to the first element. In response to the fault processing subsystem thereafter sensing an alarm state at the power output of the commanded element, the fault processing subsystem commands an element at the next higher level in the hierarchy from the first element to disable.
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公开(公告)号：US10690868B1
公开(公告)日：2020-06-23
申请号：US16154589
申请日：2018-10-08
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Joel Richard Goergen , Mehmet Onder Cap , Arjun Jayaprakash , Damaruganath Pinjala , Marc Henry Mantelli , Umeshbabu Nandanan , Jatin Kohli , Rohit Dev Gupta
Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.
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公开(公告)号：US20180088656A1
公开(公告)日：2018-03-29
申请号：US15277560
申请日：2016-09-27
Applicant: Cisco Technology, Inc.
CPC classification number: G06F1/3237 , G01R31/44 , G06F1/305 , G06F1/3253 , G06F1/3287 , H02H3/044 , H02H3/05 , H02H7/30
Abstract: A fault processing subsystem of an electronics assembly, senses an alarm state at an output of a first power distribution element of multiple power distribution elements arranged in a hierarchy in the electronics assembly. The first element is at a level of the hierarchy other than the top level, and the alarm state corresponds to an output of the first element being different than an expected output of that element. The fault processing subsystem commands, in response to the sensing the alarm state, the first element to disable via a control input to the first element. In response to the fault processing subsystem thereafter sensing an alarm state at the power output of the commanded element, the fault processing subsystem commands an element at the next higher level in the hierarchy from the first element to disable.
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