公开(公告)号：US20220381514A1

公开(公告)日：2022-12-01

申请号：US17884210

申请日：2022-08-09

Applicant: DENSO CORPORATION

Inventor： Shingo OONO ,  Takahiro UNO ,  Ryuichirou INAGAKI

IPC: F28D1/053 ,  F28F9/02 ,  F28F9/26

Abstract: A heat exchanger includes tubes arranged in a stacking direction and a tank connected to the tubes. A tube of the tubes has a pair of flat portions having flat plate shapes facing each other, and a curved portion connecting ends of the pair of flat portions. The tank includes a plate having insertion holes into which the tubes are inserted, and container. The plate has a first portion along a longitudinal direction of the tubes, and a second portion extending from an end of the first portion toward the container. When the plate is viewed in the stacking direction, a boundary between the first portion and the second portion is shifted from a boundary between each of the pair of flat portions and the curved portion toward the pair of flat portions.

公开(公告)号：US20170314515A1

公开(公告)日：2017-11-02

申请号：US15520486

申请日：2015-11-13

Applicant: DENSO CORPORATION

Inventor： Shingo OONO ,  Tomohiro SHIMAZU ,  Yasuhiro MIZUNO ,  Ryohei TOMITA

IPC: F02M26/32 ,  F01P3/18 ,  F02B29/04 ,  F28F21/00

CPC classification number: F02M26/32 ,  F01P3/18 ,  F02B29/0462 ,  F28F21/00 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L2224/33 ,  H01L2924/181 ,  Y02T10/146 ,  H01L2924/00012

Abstract: A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.

公开(公告)号：US20190264984A1

公开(公告)日：2019-08-29

申请号：US16407863

申请日：2019-05-09

Applicant: DENSO CORPORATION

Inventor： Yusuke TAKAGI ,  Ryohei TOMITA ,  Shingo OONO

IPC: F28D9/00 ,  F28F3/08 ,  H01L23/46 ,  H05K7/20

Abstract: A stacked heat exchanger includes: passage tubes stacked with each other to support a heat exchange object, a passage being defined in the passage tube for a heat medium to exchange heat with the heat exchange object; and a pipe connected to one of the passage tubes located at one end in a stacking direction of the plurality of passage tubes. Each of the passage tubes has a protruding pipe portion protruding in the stacking direction and communicating with the adjacent passage tube in the stacking direction. The one of the passage tubes located at the one end in the stacking direction is an in/out passage tube. The pipe has a surface at one end in a longitudinal direction of the pipe, and the surface intersects the longitudinal direction of the pipe and is joined to the in/out passage tube.

公开(公告)号：US20180098457A1

公开(公告)日：2018-04-05

申请号：US15718526

申请日：2017-09-28

Applicant: DENSO CORPORATION

Inventor： Kazuya TAKEUCHI ,  Naoki HIRASAWA ,  Hiromi ICHIJO ,  Shingo OONO ,  Takuya OIZUMI

IPC: H05K7/20 ,  H02M7/00 ,  H01L23/46

CPC classification number: H05K7/209 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/46 ,  H01L23/473 ,  H02M3/158 ,  H02M7/003 ,  H02M7/5387 ,  H02M2001/007 ,  H02M2001/008 ,  H02M2001/327 ,  H05K7/20854 ,  H05K7/20927

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

公开(公告)号：US20200206849A1

公开(公告)日：2020-07-02

申请号：US16614912

申请日：2018-05-24

Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) ,  DENSO CORPORATION

Inventor： Takahiro IZUMI ,  Akihiro TSURUNO ,  Shimpei KIMURA ,  Yuji SHIBUYA ,  Takahiro SHINODA ,  Shogo YAMADA ,  Shingo OONO

IPC: B23K35/28 ,  B23K1/00 ,  B23K35/02 ,  C22C21/14 ,  C22C21/16

Abstract: This aluminum alloy brazing sheet is provided with: a core material comprising 2.0 mass % or less (including 0 mass %) of Mg and a remainder of Al and unavoidable impurities; and a brazing material comprising Si, Bi, Mg, and a remainder of Al and unavoidable impurities. The aluminum alloy brazing sheet satisfies the expressions 3≤CSi≤13, 0.13CMg−0.3≤CBi≤0.58CMg0.45, CMg-b≥0.1, and 0.2≤CMg≤1.1 when the Si content of the brazing material is denoted by CSi, the Bi content of the brazing material is denoted by CBi, the Mg content of the brazing material is denoted by CMg-b, the Mg content of the core material is denoted by CMg-c, and CMg=CMg-b+CMg-c/2.

公开(公告)号：US20200086430A1

公开(公告)日：2020-03-19

申请号：US16616308

申请日：2018-05-24

Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) ,  DENSO CORPORATION

Inventor： Takahiro IZUMI ,  Akihiro TSURUNO ,  Shimpei KIMURA ,  Yuji SHIBUYA ,  Takahiro SHINODA ,  Shogo YAMADA ,  Shingo OONO

IPC: B23K35/02 ,  B23K1/00 ,  B23K35/28 ,  C22C21/02

Abstract: Provided is a brazing method for an aluminum alloy brazing sheet provided with a core material and a brazing material in which the Si content of the brazing material is denoted by CSi, the Bi content of the brazing material is denoted by CBi, the Mg content of the brazing material is denoted by CMg-b, the Mg content of the core material is denoted by CMg-c, CMg=CMg-b+CMg-c/2, and an aluminum alloy brazing sheet satisfying 3≤CSi≤13, 0.13CMg−0.3≤CBi≤0.58CMg0.45, CMg-b≥0.1, and 0.2≤CMg≤1.1 is brazed in an inert gas atmosphere at a heating temperature of 560-620° C. without using flux.

公开(公告)号：US20150306934A1

公开(公告)日：2015-10-29

申请号：US14650580

申请日：2013-12-10

Applicant: DENSO CORPORATION

Inventor： Shingo OONO ,  Shota AKAGI

IPC: B60H1/00

CPC classification number: B60H1/00328 ,  B60H1/00335 ,  B60K11/04 ,  F01P2003/182 ,  F28D1/0452 ,  F28D1/05391 ,  F28F9/0224 ,  F28F2210/08

Abstract: A vehicle heat exchanger includes a low-temperature side radiator, a condenser, and a high-temperature side radiator, which are aligned in an airflow direction and are integrated together. The low-temperature side radiator includes an inflow portion and an upper path, which are located in an upper portion thereof. In addition, the low-temperature side radiator includes a lower path and an outlet portion, which are located in a lower portion thereof and communicate with the upper path. A subcooler of the condenser overlaps, in the airflow direction, with at least a part of the lower path of the low-temperature side radiator. As a result, thermal influence by the low-temperature side radiator on the subcooler of the condenser can be reduced.

Abstract translation: 车辆用热交换器包括在气流方向上排列并且结合在一起的低温侧散热器，冷凝器和高温侧散热器。 低温侧散热器包括位于其上部的流入部分和上部路径。 此外，低温侧散热器包括位于其下部并与上部路径连通的下部路径和出口部。 冷凝器的冷却器在气流方向上与低温侧散热器的下部路径的至少一部分重叠。 结果，能够降低低温侧散热器对冷凝器的过冷却器的热影响。