公开(公告)号：US11445304B2

公开(公告)日：2022-09-13

申请号：US16837258

申请日：2020-04-01

Applicant: DENSO CORPORATION

Inventor： Tatsuya Kamiya ,  Itaru Ishii ,  Tomoki Tanemura ,  Takashi Aoki ,  Tetsuya Katoh

IPC: H04R17/02 ,  B81B7/00 ,  H04R19/00 ,  G01H11/08 ,  G01N29/12 ,  H04R19/04

Abstract: An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.

公开(公告)号：US11667247B2

公开(公告)日：2023-06-06

申请号：US16922030

申请日：2020-07-07

Applicant: DENSO CORPORATION

Inventor： Tatsuya Kamiya ,  Itaru Ishii ,  Tomoki Tanemura ,  Takashi Aoki ,  Tetsuya Katoh

IPC: B60R11/00 ,  G01S15/931 ,  G01S7/524 ,  G01S7/521

CPC classification number: B60R11/00 ,  G01S7/521 ,  G01S15/931 ,  B60R2011/004 ,  G01S2015/938

Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.

公开(公告)号：US09658121B2

公开(公告)日：2017-05-23

申请号：US14913067

申请日：2014-07-30

Applicant: DENSO CORPORATION

Inventor： Takashi Inoue ,  Kensuke Hata ,  Tetsuya Katoh ,  Kenichi Sakai ,  Mayumi Uno ,  Junichi Takeya

IPC: G01L1/22 ,  G01L1/18 ,  H01L51/05

CPC classification number: G01L1/2293 ,  G01L1/18 ,  H01L29/22 ,  H01L29/84 ,  H01L51/057

Abstract: A load sensor is constituted by a rib and a vertical transistor including an organic semiconductor film, and a load measurement can be executed based on a change of a gap between a drain electrode and a source electrode which is a channel length of the vertical transistor. Therefore, a change of a current Ids is in a linear relationship to a load applied to the load sensor.