Transistor device structures, and methods for forming such structures
    1.
    发明授权
    Transistor device structures, and methods for forming such structures 有权
    晶体管器件结构,以及形成这种结构的方法

    公开(公告)号:US6063673A

    公开(公告)日:2000-05-16

    申请号:US144512

    申请日:1998-08-31

    摘要: In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, the invention includes a resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.

    摘要翻译: 一方面,一种在半导体衬底上形成晶体管器件的方法,包括:a)在衬底上形成晶体管栅极; b)形成与晶体管栅极可操作地相邻的第一极性源极有源区和第一极性漏极有源区; 以及c)形成第二极性内部结合区域,所述第二极性内部结合区域完全接收在所述第一极性区域之一内。 在另一方面,一种晶体管器件,包括:a)半导体衬底上的晶体管栅极; b)可操作地邻近晶体管栅极的第一极性源极有源区和第一极性漏极有源区; 以及c)完全接收在所述第一极性区域之一内的第二极性内部连接区域。 在另一方面,本发明包括一种电阻器,包括:a)半导体衬底上的栅极,栅极由栅极电压供电; b)第一极性源有源区和可操作地邻近电动门的第一极性漏极有源区; c)完全接收在所述第一极性区域之一内的第二极性内部连接区域; 以及d)所述第一极性源极活性区域和所述第一极性漏极有源区域之间的电流,所述电流基本上线性地取决于所述漏极区域处的电压。

    Transistor device structures, and methods for forming such structures
    2.
    发明授权
    Transistor device structures, and methods for forming such structures 有权
    晶体管器件结构,以及形成这种结构的方法

    公开(公告)号:US06144068A

    公开(公告)日:2000-11-07

    申请号:US277030

    申请日:1999-03-25

    摘要: In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, A resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.

    摘要翻译: 一方面,一种在半导体衬底上形成晶体管器件的方法,包括:a)在衬底上形成晶体管栅极; b)形成与晶体管栅极可操作地相邻的第一极性源极有源区和第一极性漏极有源区; 以及c)形成第二极性内部结合区域,所述第二极性内部结合区域完全接收在所述第一极性区域之一内。 在另一方面,一种晶体管器件,包括:a)半导体衬底上的晶体管栅极; b)可操作地邻近晶体管栅极的第一极性源极有源区和第一极性漏极有源区; 以及c)完全接收在所述第一极性区域之一内的第二极性内部连接区域。 在另一方面,一种电阻器,包括:a)半导体衬底上的栅极,栅极由栅极电压供电; b)第一极性源有源区和可操作地邻近电动门的第一极性漏极有源区; c)完全接收在所述第一极性区域之一内的第二极性内部连接区域; 以及d)所述第一极性源极活性区域和所述第一极性漏极有源区域之间的电流,所述电流基本上线性地取决于所述漏极区域处的电压。

    Transistor device structures
    3.
    发明授权
    Transistor device structures 失效
    晶体管器件结构

    公开(公告)号:US5955760A

    公开(公告)日:1999-09-21

    申请号:US858861

    申请日:1997-05-19

    摘要: In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, the invention includes a resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.

    摘要翻译: 一方面,一种在半导体衬底上形成晶体管器件的方法,包括:a)在衬底上形成晶体管栅极; b)形成与晶体管栅极可操作地相邻的第一极性源极有源区和第一极性漏极有源区; 以及c)形成第二极性内部结合区域,所述第二极性内部结合区域完全接收在所述第一极性区域之一内。 在另一方面,一种晶体管器件,包括:a)半导体衬底上的晶体管栅极; b)可操作地邻近晶体管栅极的第一极性源极有源区和第一极性漏极有源区; 以及c)完全接收在所述第一极性区域之一内的第二极性内部连接区域。 在另一方面,本发明包括一种电阻器,包括:a)半导体衬底上的栅极,栅极由栅极电压供电; b)第一极性源有源区和可操作地邻近电动门的第一极性漏极有源区; c)完全接收在所述第一极性区域之一内的第二极性内部连接区域; 以及d)所述第一极性源极活性区域和所述第一极性漏极有源区域之间的电流,所述电流基本上线性地取决于所述漏极区域处的电压。

    Method of making an asymmetric transistor
    4.
    发明授权
    Method of making an asymmetric transistor 失效
    制造不对称晶体管的方法

    公开(公告)号:US5811338A

    公开(公告)日:1998-09-22

    申请号:US694601

    申请日:1996-08-09

    摘要: In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the. substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, A resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.

    摘要翻译: 一方面,一种用于在半导体衬底上形成晶体管器件的方法,包括:a)在其上形成晶体管栅极。 基质; b)形成与晶体管栅极可操作地相邻的第一极性源极有源区和第一极性漏极有源区; 以及c)形成第二极性内部结合区域,所述第二极性内部结合区域完全接收在所述第一极性区域之一内。 在另一方面,一种晶体管器件,包括:a)半导体衬底上的晶体管栅极; b)可操作地邻近晶体管栅极的第一极性源极有源区和第一极性漏极有源区; 以及c)完全接收在所述第一极性区域之一内的第二极性内部连接区域。 在另一方面,一种电阻器,包括:a)半导体衬底上的栅极,栅极由栅极电压供电; b)第一极性源有源区和可操作地邻近电动门的第一极性漏极有源区; c)完全接收在所述第一极性区域之一内的第二极性内部连接区域; 以及d)所述第一极性源极活性区域和所述第一极性漏极有源区域之间的电流,所述电流基本上线性地取决于所述漏极区域处的电压。

    Static memory cell and method of manufacturing a static memory cell
    5.
    发明授权
    Static memory cell and method of manufacturing a static memory cell 失效
    静态存储单元和制造静态存储单元的方法

    公开(公告)号:US5976926A

    公开(公告)日:1999-11-02

    申请号:US948889

    申请日:1997-10-10

    摘要: A static memory cell having no more than three transistors. A static memory cell comprises a semiconductor substrate of a first conductivity type; a buried layer in the substrate, the buried layer having a second conductivity type opposite to the first conductivity type; a transistor formed over the buried layer, the transistor having a source of the second conductivity type, a gate, and a drain of the second conductivity type, the source having a depth in the substrate greater than the depth of the drain; and alternating layers of insulative and conductive material formed proximate the source, including two conductive layers and two insulative layers, one of the insulative layers being in junction relation to the source.

    摘要翻译: 具有不超过三个晶体管的静态存储单元。 静态存储单元包括第一导电类型的半导体衬底; 所述掩埋层在所述衬底中,所述掩埋层具有与所述第一导电类型相反的第二导电类型; 形成在所述掩埋层上的晶体管,所述晶体管具有所述第二导电类型的源极,所述第二导电类型的栅极和漏极,所述源极在所述衬底中的深度大于所述漏极的深度; 以及在源极附近形成的绝缘和导电材料的交替层,包括两个导电层和两个绝缘层,一个绝缘层与源极结合。

    Method of manufacturing a novel static memory cell having a tunnel diode
    6.
    发明授权
    Method of manufacturing a novel static memory cell having a tunnel diode 失效
    制造具有隧道二极管的新型静态存储单元的方法

    公开(公告)号:US5672536A

    公开(公告)日:1997-09-30

    申请号:US657300

    申请日:1996-06-03

    摘要: A static memory cell having no more than three transistors. A static memory cell is formed by providing a semiconductor substrate; forming a buried n-type layer in the substrate, the n-type layer having a first average n-type dopant concentration of at least 1.times.10.sup.16 ions/cm.sup.3 ; forming an n-channel transistor relative to the substrate over the buried n-type layer, the n-channel transistor having a source, a gate, and a drain, the source having a second average n-type dopant concentration of at least 1.times.10.sup.19 ions/cm.sup.3 and the drain having a third average n-type dopant concentration of at least 1.times.10.sup.19 ions/cm.sup.3, and the source having a depth deeper than the drain so as to be closer to the buried n-type layer than the drain; and forming a p-type region in junction with the source to define a tunnel diode between the p-type region and the source.

    摘要翻译: 具有不超过三个晶体管的静态存储单元。 通过提供半导体衬底形成静态存储单元; 在衬底中形成掩埋的n型层,n型层具有至少1×10 16个离子/ cm 3的第一平均n型掺杂剂浓度; 在所述掩埋的n型层上形成相对于所述衬底的n沟道晶体管,所述n沟道晶体管具有源极,栅极和漏极,所述源极具有至少1×1019个离子的第二平均n型掺杂剂浓度 并且所述漏极具有至少1×1019个离子/ cm 3的第三平均n型掺杂剂浓度,并且所述源的深度比所述漏极深,以便比所述漏极更接近所述掩埋的n型层; 以及在与源极连接处形成p型区域以在p型区域和源极之间限定隧道二极管。

    Advance metallization process
    7.
    发明授权
    Advance metallization process 有权
    推进金属化过程

    公开(公告)号:US06281109B1

    公开(公告)日:2001-08-28

    申请号:US09571074

    申请日:2000-05-15

    IPC分类号: H01L214763

    摘要: An exemplary implementation of the present invention includes a method for forming conductive lines fabricated in a semiconductor device, the method comprising the steps of forming a first layer of patterned conductive lines, having substantially vertical sidewalls, on a supporting material; of forming insulative spacers about the substantially vertical sidewalls; of forming trenches into the supporting material that align to the insulative spacers; and of forming a second layer of patterned conductive lines such that each line is at least partially embedded within a corresponding trench. Preferably, the conductive lines, formed by a double metal process, are recessed into a supporting material that has a substantially planar surface.

    摘要翻译: 本发明的示例性实施方案包括一种用于形成在半导体器件中制造导电线的方法,该方法包括以下步骤:在支撑材料上形成具有基本上垂直的侧壁的图案化导电线的第一层; 围绕所述基本上垂直的侧壁形成绝缘隔离物; 将沟槽形成到与绝缘间隔件对准的支撑材料中; 并且形成图案化导电线的第二层,使得每条线至少部分地嵌入相应的沟槽内。 优选地,由双金属工艺形成的导线凹入到具有基本上平坦的表面的支撑材料中。

    Static memory cell and method of forming static memory cell
    8.
    发明授权
    Static memory cell and method of forming static memory cell 失效
    静态存储单元和静态存储单元的制造方法

    公开(公告)号:US06184539B2

    公开(公告)日:2001-02-06

    申请号:US09073074

    申请日:1998-05-04

    IPC分类号: H01L2906

    摘要: A static memory cell having no more than three transistors. A static memory cell comprises a semiconductor substrate of a first conductivity type; a buried layer in the substrate, the buried layer having a second conductivity type opposite to the first conductivity type; a transistor formed over the buried layer, the transistor having a source of the second conductivity type, a gate, and a drain of the second conductivity type, the source having a depth in the substrate greater than the depth of the drain; and alternating layers of insulative and conductive material formed proximate the source, including two conductive layers and two insulative layers, one of the insulative layers being in junction relation to the source.

    摘要翻译: 具有不超过三个晶体管的静态存储单元。 静态存储单元包括第一导电类型的半导体衬底; 所述掩埋层在所述衬底中,所述掩埋层具有与所述第一导电类型相反的第二导电类型; 形成在所述掩埋层上的晶体管,所述晶体管具有所述第二导电类型的源极,所述第二导电类型的栅极和漏极,所述源极在所述衬底中的深度大于所述漏极的深度; 以及在源极附近形成的绝缘和导电材料的交替层,包括两个导电层和两个绝缘层,绝缘层中的一个与源极连接。

    NMOS field effect transistors and methods of forming NMOS field effect
transistors
    9.
    发明授权
    NMOS field effect transistors and methods of forming NMOS field effect transistors 失效
    NMOS场效应晶体管和形成NMOS场效应晶体管的方法

    公开(公告)号:US6022783A

    公开(公告)日:2000-02-08

    申请号:US902763

    申请日:1997-07-30

    申请人: Jeff Zhiqiang Wu

    发明人: Jeff Zhiqiang Wu

    CPC分类号: H01L29/66636 H01L29/7834

    摘要: A semiconductor processing method of forming an NMOS field effect transistor includes, a) providing a projecting mesa of semiconductive material from a bulk semiconductor substrate, the mesa defining a semiconductor substrate floor and walls rising upwardly therefrom; b) providing a gate dielectric layer and a gate atop the semiconductive mesa; c) providing a pair of opposing LDD regions within the semiconductive mesa, the respective LDD regions running along one of the mesa walls; and d) providing source and drain diffusion regions within the bulk semiconductor substrate floor which respectively interconnect with the opposing LDD regions of the mesa. NMOS field effect transistors are also disclosed.

    摘要翻译: 形成NMOS场效应晶体管的半导体处理方法包括:a)从体半导体衬底提供半导体材料的突出台面,所述台面限定半导体衬底地板和从其向上升起的壁; b)在半导体台面的顶部提供栅极电介质层和栅极; c)在半导体台面内提供一对相对的LDD区域,各个LDD区域沿着台面壁之一延伸; 以及d)在所述体半导体衬底底板内提供分别与所述台面的相对的LDD区域互连的源极和漏极扩散区域。 还公开了NMOS场效应晶体管。

    Advance metallization process
    10.
    发明授权

    公开(公告)号:US06653220B2

    公开(公告)日:2003-11-25

    申请号:US09922523

    申请日:2001-08-03

    IPC分类号: H01L214763

    摘要: An exemplary implementation of the present invention includes a method for forming conductive lines fabricated in a semiconductor device, the method comprising the steps of forming a first layer of patterned conductive lines, having substantially vertical sidewalls, on a supporting material; of forming insulative spacers about the substantially vertical sidewalls; of forming trenches into the supporting material that align to the insulative spacers; and of forming a second layer of patterned conductive lines such that each line is at least partially embedded within a corresponding trench. Preferably, the conductive lines, formed by a double metal process, are recessed into a supporting material that has a substantially planar surface.