Abstract:
An exemplary implementation of the present invention includes a method for forming conductive lines fabricated in a semiconductor device, the method comprising the steps of forming a first layer of patterned conductive lines, having substantially vertical sidewalls, on a supporting material; of forming insulative spacers about the substantially vertical sidewalls; of forming trenches into the supporting material that align to the insulative spacers; and of forming a second layer of patterned conductive lines such that each line is at least partially embedded within a corresponding trench. Preferably, the conductive lines, formed by a double metal process, are recessed into a supporting material that has a substantially planar surface.
Abstract:
A static memory cell having no more than three transistors. A static memory cell comprises a semiconductor substrate of a first conductivity type; a buried layer in the substrate, the buried layer having a second conductivity type opposite to the first conductivity type; a transistor formed over the buried layer, the transistor having a source of the second conductivity type, a gate, and a drain of the second conductivity type, the source having a depth in the substrate greater than the depth of the drain; and alternating layers of insulative and conductive material formed proximate the source, including two conductive layers and two insulative layers, one of the insulative layers being in junction relation to the source.
Abstract:
A semiconductor processing method of forming an NMOS field effect transistor includes, a) providing a projecting mesa of semiconductive material from a bulk semiconductor substrate, the mesa defining a semiconductor substrate floor and walls rising upwardly therefrom; b) providing a gate dielectric layer and a gate atop the semiconductive mesa; c) providing a pair of opposing LDD regions within the semiconductive mesa, the respective LDD regions running along one of the mesa walls; and d) providing source and drain diffusion regions within the bulk semiconductor substrate floor which respectively interconnect with the opposing LDD regions of the mesa. NMOS field effect transistors are also disclosed.
Abstract:
In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, the invention includes a resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.
Abstract:
A static memory cell having no more than three transistors. A static memory cell is formed by providing a semiconductor substrate; forming a buried n-type layer in the substrate, the n-type layer having a first average n-type dopant concentration of at least 1.times.10.sup.16 ions/cm.sup.3 ; forming an n-channel transistor relative to the substrate over the buried n-type layer, the n-channel transistor having a source, a gate, and a drain, the source having a second average n-type dopant concentration of at least 1.times.10.sup.19 ions/cm.sup.3 and the drain having a third average n-type dopant concentration of at least 1.times.10.sup.19 ions/cm.sup.3, and the source having a depth deeper than the drain so as to be closer to the buried n-type layer than the drain; and forming a p-type region in junction with the source to define a tunnel diode between the p-type region and the source.
Abstract translation:具有不超过三个晶体管的静态存储单元。 通过提供半导体衬底形成静态存储单元; 在衬底中形成掩埋的n型层,n型层具有至少1×10 16个离子/ cm 3的第一平均n型掺杂剂浓度; 在所述掩埋的n型层上形成相对于所述衬底的n沟道晶体管,所述n沟道晶体管具有源极,栅极和漏极,所述源极具有至少1×1019个离子的第二平均n型掺杂剂浓度 并且所述漏极具有至少1×1019个离子/ cm 3的第三平均n型掺杂剂浓度,并且所述源的深度比所述漏极深,以便比所述漏极更接近所述掩埋的n型层; 以及在与源极连接处形成p型区域以在p型区域和源极之间限定隧道二极管。
Abstract:
A static memory cell having no more than three transistors. A static memory cell is formed by providing a semiconductor substrate; forming a buried n-type layer in the substrate, the n-type layer having a first average n-type dopant concentration of at least 1×1016 ions/cm3; forming an n-channel transistor relative to the substrate over the buried n-type layer, the n-channel transistor having a source, a gate, and a drain, the source having a second average n-type dopant concentration of at least 1×1019 ions/cm3 and the drain having a third average n-type dopant concentration of at least 1×1019 ions/cm3, and the source having a depth deeper than the drain so as to be closer to the buried n-type layer than the drain; and forming a p-type region in junction with the source to define a tunnel diode between the p-type region and the source.
Abstract translation:具有不超过三个晶体管的静态存储单元。 通过提供半导体衬底形成静态存储单元; 在衬底中形成掩埋的n型层,n型层具有至少1×10 16个离子/ cm 3的第一平均n型掺杂剂浓度; 在所述掩埋的n型层上形成相对于所述衬底的n沟道晶体管,所述n沟道晶体管具有源极,栅极和漏极,所述源极具有至少1×1019个离子的第二平均n型掺杂剂浓度 并且所述漏极具有至少1×1019个离子/ cm 3的第三平均n型掺杂剂浓度,并且所述源的深度比所述漏极深,以便比所述漏极更接近所述掩埋的n型层; 以及在与源极连接处形成p型区域以在p型区域和源极之间限定隧道二极管。
Abstract:
Methods of forming field effect transistors. In one aspect, a method of forming a field effect transistor includes: a) providing a gate structure over a semiconductor substrate, the gate structure comprising a conductively-doped polysilicon region and a dopant masking cap over the conductively-doped polysilicon region; b) providing a layer of polysilicon over the substrate and over the dopant masking cap of the gate structure, the polysilicon layer defining a pair of polysilicon outward projections extending from the semiconductor substrate adjacent the gate structure; c) removing the layer of polysilicon from over the dopant masking cap; d) while the dopant masking cap is over the polysilicon region, conductively doping the pair of polysilicon projections with one of an n-type or a p-type conductivity enhancing dopant impurity; and e) out-diffusing the one of the n-type conductivity enhancing dopant impurity or the p-type conductivity enhancing dopant impurity from the pair of polysilicon projections into the semiconductor substrate to provide one of NMOS or PMOS type diffusion regions, respectively, within the substrate adjacent the gate line.
Abstract:
In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, the invention includes a resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.
Abstract:
A method of forming CMOS integrated circuitry includes, a) providing a series of field oxide regions and a series of gate lines over a semiconductor substrate, a first gate line being positioned for formation of an NMOS transistor, a second gate line being positioned for formation of a PMOS transistor; b) providing a layer of polysilicon to define a first and second pairs of polysilicon outward projections extending from the semiconductor substrate adjacent the first and second gate lines, respectively; c) masking one of the first or second pair of polysilicon projections while conductively doping the other of the first or second pair with an n-type or a p-type conductivity enhancing dopant impurity, respectively; d) masking the other of the first or second pair of polysilicon projections while conductively doping the one of the first or second pair of polysilicon projections with an n-type or a p-type conductivity enhancing dopant impurity, respectively; e) out-diffusing conductivity enhancing dopant impurity from the respective pairs of polysilicon projections into the semiconductor substrate to provide respective NMOS and PMOS type diffusion regions within the substrate adjacent the respective first and second gate lines. A combination of blanket doping and masked doping to produce the respective NMOS and PMOS type diffusion regions is also contemplated. The invention also has utility to formation of only one of NMOS or PMOS type field effect transistors, as opposed to CMOS formation.
Abstract:
In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the. substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, A resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.