公开(公告)号：US09693459B2

公开(公告)日：2017-06-27

申请号：US14801422

申请日：2015-07-16

Applicant: Delphi Technologies, Inc.

Inventor： Rodrigo Franco

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K1/144 ,  H05K1/111 ,  H05K1/115 ,  H05K1/14 ,  H05K1/141 ,  H05K1/145 ,  H05K1/181 ,  H05K1/183 ,  H05K3/32 ,  H05K3/3442 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/095 ,  H05K2201/10166 ,  H05K2201/10727

Abstract: The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board.

公开(公告)号：US09715986B2

公开(公告)日：2017-07-25

申请号：US14425948

申请日：2013-07-23

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Didimo Garcia Neto ,  Rodrigo Franco

IPC: H05K7/00 ,  H01H89/00 ,  H01H50/02 ,  H01H85/02 ,  H01H85/20 ,  H01H50/04

CPC classification number: H01H89/00 ,  H01H50/021 ,  H01H50/048 ,  H01H85/0241 ,  H01H85/2035 ,  H01H2085/0275 ,  H01H2085/208

Abstract: A relay assembly configured for use in a vehicle electrical distribution center. The relay assembly includes a circuit board, a first and second relay disposed the circuit board and a plurality of terminals electrically coupled to the first and second relays. The relay assembly also includes removable fuses to protect the circuits controlled by the first and second relays against over-current conditions. In one embodiment, the relay assembly is packaged as a mini-ISO relay package.

公开(公告)号：US20170019998A1

公开(公告)日：2017-01-19

申请号：US14801422

申请日：2015-07-16

Applicant: Delphi Technologies, Inc.

Inventor： Rodrigo Franco

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/40 ,  H05K3/36 ,  H05K3/42 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/144 ,  H05K1/111 ,  H05K1/115 ,  H05K1/14 ,  H05K1/141 ,  H05K1/145 ,  H05K1/181 ,  H05K1/183 ,  H05K3/32 ,  H05K3/3442 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/095 ,  H05K2201/10166 ,  H05K2201/10727

Abstract: The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board.

Abstract translation: 电路板组件包括具有附接到第一电路板的主表面的第一多个电子部件的第一电路板。 第一组多个电子部件电连接到限定在第一电路板的主表面上的第一多个导电焊盘。 第二电路板具有附接到第二电路板的第一主表面的第二多个电子部件。 所述第二多个电子部件电连接到限定在所述第二电路板的第二主表面上的第二多个导电焊盘。 第一和第二电路板通过联接第一和第二多个导电焊盘而附接。 第一电路板上的第一多个电子部件的一部分设置在由第二电路板的第二主表面限定的空腔内。

公开(公告)号：US20150228437A1

公开(公告)日：2015-08-13

申请号：US14425948

申请日：2013-07-23

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Didimo Garcia Neto ,  Rodrigo Franco

IPC: H01H89/00

CPC classification number: H01H89/00 ,  H01H50/021 ,  H01H50/048 ,  H01H85/0241 ,  H01H85/2035 ,  H01H2085/0275 ,  H01H2085/208

Abstract: A relay assembly configured for use in a vehicle electrical distribution center. The relay assembly includes a circuit board, a first and second relay disposed the circuit board and a plurality of terminals electrically coupled to the first and second relays. The relay assembly also includes removable fuses to protect the circuits controlled by the first and second relays against over-current conditions. The relay assembly may be packaged as a mini-ISO relay package.

Abstract translation: 一种构造成用于车辆配电中心的继电器组件。 继电器组件包括电路板，布置在电路板上的第一和第二继电器以及电连接到第一和第二继电器的多个端子。 继电器组件还包括可移除的保险丝，以保护由第一和第二继电器控制的电路免受过电流条件的影响。 继电器组件可以作为小型ISO继电器封装封装。