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    Edge seal for electronics assembly suitable for exposure to electrically conductive coolant
    1.
    发明授权
    Edge seal for electronics assembly suitable for exposure to electrically conductive coolant 有权
    用于电子组件的边缘密封，适用于暴露于导电冷却剂

    公开(公告)号：US09131630B2

    公开(公告)日：2015-09-08

    申请号：US13917921

    申请日：2013-06-14

    Applicant: DELPHI TECHNOLOGIES, INC.

    Inventor： Scott D. Brandenburg ,  Richard D. Parker ,  Khalid M. Eltom

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 液体冷却的电力电子组件被配置为使用导电冷却剂来冷却功率电子器件，所述电子器件使用围绕电介质板的周边的金属套管密封的电介质板，以形成器件组件。 该配置允许电子设备和冷却剂之间的更直接接触，同时保护电子设备免受潜在导电的冷却剂的接触。 用于形成电介质板和壳体的材料被选择为具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

    Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement
    4.
    发明申请
    Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement 审中-公开

    公开(公告)号：US20170098750A1

    公开(公告)日：2017-04-06

    申请号：US14873763

    申请日：2015-10-02

    Applicant: Delphi Technologies, Inc.

    Inventor： Carl W. Berlin ,  Scott D. Brandenburg ,  Bruce A. Myers

    IPC: H01L35/30

    CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  F01N2510/00 ,  F01N2530/00 ,  F01N2530/04 ,  Y02T10/16

    Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold includes a first heat-exchanger, a first dielectric-layer, a TEG, and a direct-bond-copper-arrangement (DBC). The first dielectric-layer overlies a portion of the outer surface of the first heat-exchanger. The first dielectric-layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat-exchanger. The TEG defines a first contact suitable to be coupled thermally and electrically to the first conductor-layer. The DBC is interposed between the first dielectric-layer and the first contact of the TEG. The DBC is formed by an adhesion-layer formed of high-adhesion-copper-thick-film in contact with the first dielectric-layer, a bond-layer formed of copper-thick-film that overlies and is in contact with the adhesion-layer opposite the first-dielectric-layer, and a copper-foil-layer that overlies and is in contact with the bond-layer opposite the adhesion-layer.

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