摘要:
A system, method and computer program product produce spike-dependent plasticity in an artificial synapse. A method includes: an electronic device generating a pre-synaptic pulse that occurs a predetermined period of time after receiving a pre-synaptic spike at a first input. The electronic device generating a post-synaptic pulse that starts at a baseline value and reaches a first voltage value a first period of time after receiving a post-synaptic spike at a second input, followed by a second voltage value a second period of time after the post synaptic spike, followed by a return to said baseline voltage a third period of time after the post-synaptic spike. The generated pre-synaptic pulse is applied to a pre-synaptic node of a synaptic device in series with a rectifying element that has a turn-on voltage based on a threshold. The generated post-synaptic pulse is applied to a post-synaptic node of said synaptic device.
摘要:
A system, method and computer program product produce spike-dependent plasticity in an artificial synapse. A method includes: an electronic device generating a pre-synaptic pulse that occurs a predetermined period of time after receiving a pre-synaptic spike at a first input. The electronic device generating a post-synaptic pulse that starts at a baseline value and reaches a first voltage value a first period of time after receiving a post-synaptic spike at a second input, followed by a second voltage value a second period of time after the post synaptic spike, followed by a return to said baseline voltage a third period of time after the post-synaptic spike. The generated pre-synaptic pulse is applied to a pre-synaptic node of a synaptic device in series with a rectifying element that has a turn-on voltage based on a threshold. The generated post-synaptic pulse is applied to a post-synaptic node of said synaptic device.
摘要:
According to embodiments of the invention, a system, method and computer program product producing spike-dependent plasticity in an artificial synapse. In an embodiment, a method includes: receiving a pre-synaptic spike in an electronic component; receiving a post-synaptic spike in the electronic component; in response to the pre-synaptic spike, generating a pre-synaptic pulse that occurs a predetermined period of time after the received pre-synaptic spike; in response to the post-synaptic spike, generating a post-synaptic pulse that starts at a baseline value and reaches a first voltage value a first period of time after the post-synaptic spike, followed by a second voltage value a second period of time after the post synaptic spike, followed by a return to the baseline voltage a third period of time after the post-synaptic spike; applying the generated pre-synaptic pulse to a pre-synaptic node of a synaptic device that includes a uni-polar, two-terminal bi-stable device in series with a rectifying element; and applying the generated post-synaptic pulse to a post-synaptic node of the synaptic device, wherein the synaptic device changes from a first conductive state to a second conductive state based on the value of input voltage applied to its pre and post-synaptic nodes, wherein the resultant state of the conductance of the synaptic device after the pre- and post-synaptic pulses are applied thereto depends on the relative timing of the received pre-synaptic spike with respect to the post synaptic spike.
摘要:
The present disclosure relates to a solid electrolyte device comprising an amorphous chalcogenide solid active electrolytic layer; first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is located between the first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is prepared by obtaining a solution of a hydrazine-based precursor to a metal chalcogenide; applying the solution onto a substrate; and thereafter annealing the precursor to convert the precursor to the amorphous metal chalcogenide. The present disclosure also relates to processes for fabricating the solid electrolyte device.
摘要:
The present disclosure relates to a solid electrolyte device comprising an amorphous chalcogenide solid active electrolytic layer; first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is located between the first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is prepared by obtaining a solution of a hydrazine-based precursor to a metal chalcogenide; applying the solution onto a substrate; and thereafter annealing the precursor to convert the precursor to the amorphous metal chalcogenide. The present disclosure also relates to processes for fabricating the solid electrolyte device.
摘要:
A device for use with a memory cross-point array of elements, each of which comprises a selection device in series with a state-holding device, in one embodiment includes a controller, configured to apply at least one voltage and/or current pulse to a selected one or more of the elements, said selected one or more of the elements including a partially- or completely-shorted selection device, so that said partially- or completely-shorted selection device passes enough current so as to damage its corresponding state-holding device and place said corresponding state-holding device in a highly resistive state, while any other selection device that is not partially- or completely-shorted passes less current so that the state-holding device corresponding to said other selection device remains unaffected. Additional systems and methods are also presented.
摘要:
A device is disclosed having a M8XY6 layer sandwiched in between a first conductive layer on the top and a second conductive layer on the bottom, wherein (i) M includes at least one element selected from the group consisting of Cu, Ag, Li, and Zn, (ii) X includes at least one Group XIV element, and (iii) Y includes at least one Group XVI element. Also disclosed is a device comprising: an MaXbYc material contacted on opposite sides by respective layers of conductive material, wherein: (i) M includes at least one element selected from the group consisting of Cu, Ag, Li, and Zn, (ii) X includes at least one Group XIV element, and (iii) Y includes at least one Group XVI element, and wherein a is in the range of 48-60 atomic percent, b is in the range of 4-10 atomic percent, c is in the range of 30-45 atomic percent, and a+b+c is at least 90 atomic percent.
摘要翻译:公开了一种器件,其具有夹在顶部的第一导电层和底部的第二导电层之间的M8XY6层,其中(i)M包括选自由Cu,Ag,Li和 Zn,(ii)X包括至少一种XIV族,和(iii)Y包括至少一个XVI族。 还公开了一种装置,包括:MaXbYc材料,在相对侧通过相应的导电材料层接触,其中:(i)M包括选自由Cu,Ag,Li和Zn组成的组中的至少一种元素,(ii) X包括至少一个第XIV族元素,和(iii)Y包括至少一个第ⅩⅥ族元素,并且其中a在48-60原子百分比的范围内,b在4-10原子百分比的范围内,c是 在30-45原子%的范围内,a + b + c为至少90原子%。
摘要:
The present disclosure relates to a solid electrolyte device comprising an amorphous chalcogenide solid active electrolytic layer; first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is located between the first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is prepared by obtaining a solution of a hydrazine-based precursor to a metal chalcogenide; applying the solution onto a substrate; and thereafter annealing the precursor to convert the precursor to the amorphous metal chalcogenide. The present disclosure also relates to processes for fabricating the solid electrolyte device.
摘要:
A device for use with a memory cross-point array of elements, each of which comprises a selection device in series with a state-holding device, in one embodiment includes a controller, configured to apply at least one voltage and/or current pulse to a selected one or more of the elements, said selected one or more of the elements including a partially- or completely-shorted selection device, so that said partially- or completely-shorted selection device passes enough current so as to damage its corresponding state-holding device and place said corresponding state-holding device in a highly resistive state, while any other selection device that is not partially- or completely-shorted passes less current so that the state-holding device corresponding to said other selection device remains unaffected. Additional systems and methods are also presented.
摘要:
A crystalline semiconductor Schottky barrier-like diode sandwiched between two conducting electrodes is in series with a memory element, a word line and a bit line, wherein the setup provides voltage margins greater than 1V and current densities greater than 5×106 A/cm2. This Schottky barrier-like diode can be fabricated under conditions compatible with low-temperature BEOL semiconductor processing, can supply high currents at low voltages, exhibits high on-off ratios, and enables large memory arrays.
摘要翻译:夹在两个导电电极之间的晶体半导体肖特基势垒状二极管与存储元件,字线和位线串联,其中,该设置提供大于1V的电压裕度和大于5×106A / cm 2的电流密度。 这种肖特基势垒状二极管可以在与低温BEOL半导体处理兼容的条件下制造,可以在低电压下提供高电流,具有高开关比,并且可以实现大型存储器阵列。