摘要:
A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.
摘要:
A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.
摘要:
An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.
摘要:
A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter.
摘要:
In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed.
摘要:
In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed.
摘要:
An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.
摘要:
An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.
摘要:
An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.
摘要:
An improved cooling assembly is disclosed, which includes a chassis enclosing a duct. The duct has a first end and a second end. A first fan is positioned at the first end of the duct and a second fan is positioned at the second end of the duct. A fan failure vent is positioned along a first side of the duct between the first and second fans.