公开(公告)号：US09908773B2

公开(公告)日：2018-03-06

申请号：US15101839

申请日：2013-12-06

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  EPCOS AG

Inventor： Damien Saint-Patrice ,  Arnoldus Den Dekker ,  Marcel Giesen ,  Florent Greco ,  Gudrun Henn ,  Jean-Louis Pornin ,  Bruno Reig

IPC: B81B1/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81C1/00293 ,  B81C2203/0145

Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.

公开(公告)号：US10532924B2

公开(公告)日：2020-01-14

申请号：US15101825

申请日：2013-12-06

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  EPCOS AG

Inventor： Damien Saint-Patrice ,  Arnoldus Den Dekker ,  Marcel Giesen ,  Gudrun Henn ,  Jean-Louis Pornin ,  Bruno Reig

IPC: H01L41/053 ,  B81B7/00 ,  B81C1/00

Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed. Several separated portions of metallic material are provided such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes. At least one diffusion barrier layer including at least one non-metallic material is arranged on the cap layer and forms a diffusion barrier against an atmosphere outside the cavity at least around the release holes. Parts of the diffusion barrier layer are not covered by the portions of metallic material.

公开(公告)号：US09199839B2

公开(公告)日：2015-12-01

申请号：US14551701

申请日：2014-11-24

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT ,  EPCOS AG

Inventor： Jean-Louis Pornin ,  Arnoldus Den Dekker ,  Marcel Giesen ,  Florent Greco ,  Gudrun Henn ,  Bruno Reig ,  Damien Saint-Patrice

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00293 ,  B81C2203/0145

Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.

Abstract translation: 用熔丝材料密封孔的方法，包括以下步骤：将一部分可润湿材料涂覆到表面上，使得其完全包围通过所述表面制成的孔，并且位于孔的外部，或完全包围第一部分 所述表面对应于所述孔的位置; 将一部分熔丝材料施加在可润湿材料的部分上以及位于可湿性材料部分周围的所述表面的第二部分上; 回收熔丝材料的部分以形成熔丝材料的凸起，其具有对应于球体的一部分的形状，其仅紧固在可湿性材料的部分上并且气密地插入孔中; 其中所述孔在回流所述熔丝材料的所述部分之前在所述表面中制成。

公开(公告)号：US20160020749A1

公开(公告)日：2016-01-21

申请号：US14773290

申请日：2014-02-20

Applicant: EPCOS AG

Inventor： Gudrun Henn ,  Bernhard Bader

IPC: H03H9/25 ,  H01L41/332 ,  H01L41/331 ,  H03H9/02 ,  H03H9/145

CPC classification number: H03H9/25 ,  H01L41/331 ,  H01L41/332 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02007 ,  H03H9/02086 ,  H03H9/02118 ,  H03H9/02818 ,  H03H9/02858 ,  H03H9/02984 ,  H03H9/0542 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/14544

Abstract: A microacoustic component includes a functional acoustic region, an inner marginal region and an outer marginal region. The cover covers the functional acoustic region and has a thin film and a bearing surface. The inner marginal region is acoustically coupled to the functional acoustic region and the bearing surface bears directly at least on a part of the inner marginal region.

Abstract translation: 微声部件包括功能声学区域，内部边缘区域和外部边缘区域。 盖覆盖功能声区，并具有薄膜和支承面。 内部边缘区域声学耦合到功能声学区域，并且支承表面直接至少在内部边缘区域的一部分上承载。

公开(公告)号：US20150225231A1

公开(公告)日：2015-08-13

申请号：US14424992

申请日：2013-07-31

Applicant: EPCOS AG

Inventor： Gudrun Henn

IPC: B81C1/00 ,  H01L41/053 ,  B81B7/00

CPC classification number: B81C1/00682 ,  B81B7/0067 ,  H01L41/053 ,  H03H9/02393 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/25 ,  H03H2003/0414 ,  H03H2003/0442

Abstract: The present invention relates to a method for producing an MEMS device (1) operating with acoustic waves. The method comprises the steps of producing an MEMS component (2) operating with acoustic waves on a substrate (3), encapsulating the component (2) with a housing layer (10), wherein the housing layer (10) is transmissive to electromagnetic radiation (14) in a wavelength range, and trimming the component (2) by irradiating the component (2) with electromagnetic radiation (14) having a wavelength lying in the wavelength range in which the housing layer (10) is transmissive to the electromagnetic radiation (14). Furthermore, the invention relates to an MEMS device (1) comprising a housing layer (10) transmissive to electromagnetic radiation (14) in the wavelength range.

Abstract translation: 本发明涉及用声波操作的MEMS器件（1）的制造方法。 该方法包括以下步骤：在衬底（3）上产生用声波操作的MEMS组件（2），用壳体层（10）封装组件（2），其中壳体层（10）对电磁辐射是透射的 （14），并且通过用具有波长范围的波长范围的电磁辐射（14）照射组分（2）来修整组分（2），其中壳体层（10）对电磁辐射是透射的 （14）。 此外，本发明涉及一种MEMS器件（1），其包括在波长范围内对电磁辐射（14）透射的壳体层（10）。