公开(公告)号：US20170078802A1

公开(公告)日：2017-03-16

申请号：US15121831

申请日：2014-03-03

Applicant: Epcos AG

Inventor： Jan Tue Ravnkilde ,  Dennis Mortensen ,  Morten Ginnerup

IPC: H04R19/04 ,  H04R7/16 ,  B81B3/00 ,  H04R9/08

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R7/16 ,  H04R19/005 ,  H04R2201/003

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

Abstract translation: 具有非圆形形状的MEMS麦克风的不均匀应力分布由具有补偿结构的结构化背板补偿，以提供与膜的应力分布相反的应力分布。

公开(公告)号：US10136226B2

公开(公告)日：2018-11-20

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/00 ,  H04R1/04 ,  H04R31/00 ,  H04R19/04 ,  B81B7/00

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

公开(公告)号：US10419858B2

公开(公告)日：2019-09-17

申请号：US15121831

申请日：2014-03-03

Applicant: Epcos AG

Inventor： Jan Tue Ravnkilde ,  Dennis Mortensen ,  Morten Ginnerup

IPC: H04R19/04 ,  B06B1/02 ,  B81B3/00 ,  H04R7/16 ,  H04R19/00

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

公开(公告)号：US20150326979A1

公开(公告)日：2015-11-12

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/04 ,  H04R1/04 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0016 ,  B81B2207/115 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。