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公开(公告)号：US10532924B2
公开(公告)日：2020-01-14
申请号：US15101825
申请日：2013-12-06
Inventor： Damien Saint-Patrice , Arnoldus Den Dekker , Marcel Giesen , Gudrun Henn , Jean-Louis Pornin , Bruno Reig
IPC: H01L41/053 , B81B7/00 , B81C1/00
Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed. Several separated portions of metallic material are provided such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes. At least one diffusion barrier layer including at least one non-metallic material is arranged on the cap layer and forms a diffusion barrier against an atmosphere outside the cavity at least around the release holes. Parts of the diffusion barrier layer are not covered by the portions of metallic material.
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Patent Agency Ranking
公开(公告)号：US09199839B2
公开(公告)日：2015-12-01
申请号：US14551701
申请日：2014-11-24
Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT , EPCOS AG
Inventor： Jean-Louis Pornin , Arnoldus Den Dekker , Marcel Giesen , Florent Greco , Gudrun Henn , Bruno Reig , Damien Saint-Patrice
CPC classification number: B81C1/00293 , B81C2203/0145
Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.
Abstract translation: 用熔丝材料密封孔的方法，包括以下步骤：将一部分可润湿材料涂覆到表面上，使得其完全包围通过所述表面制成的孔，并且位于孔的外部，或完全包围第一部分 所述表面对应于所述孔的位置; 将一部分熔丝材料施加在可润湿材料的部分上以及位于可湿性材料部分周围的所述表面的第二部分上; 回收熔丝材料的部分以形成熔丝材料的凸起，其具有对应于球体的一部分的形状，其仅紧固在可湿性材料的部分上并且气密地插入孔中; 其中所述孔在回流所述熔丝材料的所述部分之前在所述表面中制成。
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公开(公告)号：US20150326979A1
公开(公告)日：2015-11-12
申请号：US14653820
申请日：2012-12-18
Applicant: EPCOS AG
Inventor： Jan Tue Ravnkilde , Marcel Giesen , Kurt Rasmussen , Morten Ginnerup , Pirmin Hermann Otto Rombach , Wolfgang Pahl , Anton Leidl , Armin Schober , Jürgen Portmann
CPC classification number: H04R19/005 , B81B7/0016 , B81B2207/115 , H04R1/04 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。
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公开(公告)号：US10136226B2
公开(公告)日：2018-11-20
申请号：US14653820
申请日：2012-12-18
Applicant: EPCOS AG
Inventor： Jan Tue Ravnkilde , Marcel Giesen , Kurt Rasmussen , Morten Ginnerup , Pirmin Hermann Otto Rombach , Wolfgang Pahl , Anton Leidl , Armin Schober , Jürgen Portmann
Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
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公开(公告)号：US09908773B2
公开(公告)日：2018-03-06
申请号：US15101839
申请日：2013-12-06
Inventor： Damien Saint-Patrice , Arnoldus Den Dekker , Marcel Giesen , Florent Greco , Gudrun Henn , Jean-Louis Pornin , Bruno Reig
CPC classification number: B81C1/00277 , B81B7/0035 , B81C1/00293 , B81C2203/0145
Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.
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公开(公告)号：US09637379B2
公开(公告)日：2017-05-02
申请号：US14909105
申请日：2014-07-02
Applicant: EPCOS AG
Inventor： Marcel Giesen , Thomas Metzger , Phillip Ekkels , Ansgar Schäufele
CPC classification number: B81C1/00682 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00666 , B81C99/004 , G01L9/0073 , H04R31/003
Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.
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