公开(公告)号：US20240383011A1

公开(公告)日：2024-11-21

申请号：US18690157

申请日：2022-06-28

Applicant: EBARA CORPORATION

Inventor： Shuichi SUEMASA ,  Mitsuru MIYAZAKI ,  Shozo TAKAHASHI ,  Takuya INOUE

IPC: B08B1/34 ,  B08B1/12 ,  B08B1/20 ,  B08B1/40 ,  B08B5/02 ,  H01L21/67

Abstract: A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).

公开(公告)号：US20140004772A1

公开(公告)日：2014-01-02

申请号：US13891702

申请日：2013-05-10

Applicant: Ebara Corporation

Inventor： Yu ISHII ,  Kenya ITO ,  Shozo TAKAHASHI ,  Mika SUZUKI

IPC: B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B37/04

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/24 ,  B24B37/30

Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.

Abstract translation: 用于将工件抛光成镜面抛光的抛光垫附着到化学机械抛光装置的可旋转抛光台上。 诸如金属体的工件被载体保持并压靠在抛光垫上。 该抛光垫包括：具有抛光表面的弹性垫; 支撑弹性垫的可变形基层; 以及将弹性垫连接到基底层的粘合剂层。

公开(公告)号：US20190308223A1

公开(公告)日：2019-10-10

申请号：US16373004

申请日：2019-04-02

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Akira IMAMURA ,  Takuya INOUE ,  Shozo TAKAHASHI

IPC: B08B3/04 ,  G05D16/20 ,  H01L21/67

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

公开(公告)号：US20240363372A1

公开(公告)日：2024-10-31

申请号：US18642477

申请日：2024-04-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Hiroshi SOTOZAKI ,  Hiroki MIYAMOTO ,  Kenichi TAKEBUCHI ,  Saki MIYAGAWA ,  Hiroki SAITO ,  Takuya INOUE ,  Shozo TAKAHASHI ,  Ryohei ISHII

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  H01L21/67092 ,  H01L21/68707

Abstract: A substrate processing apparatus that can quickly transport a polished substrate (e.g., a wafer) to a cleaning module is disclosed. A first processing unit includes: a polishing module configured to polish the substrate W; a cleaning module configured to clean the substrate W; a drying module configured to dry the cleaned substrate W; a substrate transporter extending from one side to opposite side of the first processing unit; an elevating transporter configured to transport the substrate from the substrate transporter to the polishing module and from the polishing module to the cleaning module; and a relay transporter configured to transport the substrate. The relay transporter of the first processing unit is configured to transport the substrate between processing units.