Abstract:
There is disclosed systems and methods for retrieving files from a file server using file attributes. In one embodiment, an audio file server is accessed to retrieve prerecorded audio files using file attributes. In one embodiment, the HTTP protocol is used by adding query attributes, such as a text version of the desired message, along with other required attributes of the audio file, to the audio file server. The audio file server accepts the attributes, including the message text attributes and parses them to resolve which audio (.wav) message to retrieve. The retrieved audio file is then returned to the voice browser, which normally plays the message. In this way, IVR application developers can specify the content, speaker, language, dialect, emotion, and other attributes of a required audio file utilizing standard voice browsers to access audio files.
Abstract:
In one embodiment, file attributes of a desired file are sent along with the URL to the storing server and the attributes are used for subsequent retrieval of the file. Attributes, such as the text or title of the file, the language of the file, the creator of the file, etc, can all be added to the file in the form of metadata. Files that are recorded without metadata can have metadata attached thereto and can be retrieved using the metadata. The URL initially carries the metadata to the server and the server then both uses the metadata for indexing purposes and, if desired, adds the metadata to the file for storage with the file. In one embodiment, the files are media files used in an IVR system.
Abstract:
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
Abstract:
To communicate requirements for a digital license from a receiver of corresponding digital content to a computing device upon which the digital content is to be rendered, the receiver tunes the content and locates within the content information relating to the requirements for the license, constructs the requirements from the located information, and sends such constructed requirements to the computing device. The computing device upon receiving the sent requirements constructs the license based on such received requirements, stores such constructed license in a license store of such computing device, and thereafter renders the content only in accordance with the license. Thus, the receiver need not communicate the license itself to the computing device.
Abstract:
In one embodiment of the present invention's a system for tracking and managing data over a computer network including a plurality of application computers each operating a computer software application program is provided, comprising a key master (106, 108); a system startup module (100) connected to the key master (106, 108); a gatekeeper (102) connected to the system startup module (100); as task manager (122, 124, 126, 128's 130) connected to the key master (106, 108) and the gatekeeper (102); a central database (112, 114, 116) connected to the gatekeeper (102); a plurality of agents (132, 134, 136, 138, 140) connected to the task manager; a plurality of sub-agents (142, 144, 146, 148, 150) independently connected to the plurality of agents (132, 134, 136, 138, 140) and the plurality of application computers (152, 154,156, 158, 160); and an alert dispatcher (104) connected to the system startup module (100) and the gatekeeper (102).
Abstract:
A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.
Abstract:
A method and apparatus for measuring the curvature of a wafer. The apparatus includes a laser head that includes multiple laser sources that each emit a laser beam, each beam having a different wavelength. A CPU selects one of the sources to emit a beam. The beam is directed through a lens within the laser head and onto a surface of a wafer. The beam is reflected from the surface of the wafer and detected by a detector. The present invention includes a motor to cause relative motion between the laser head and the wafer such that the beam scans across the surface of the wafer, relaying data to the detector and the CPU. The CPU calculates the curvature of the wafer surface using the scanned data. The CPU selects a different laser source to direct a beam having a different wavelength at the wafer surface to avoid destructive interference that may occur with previously-used wavelengths. Other embodiments include the laser sources within a carousel apparatus, and the addition of a beamsplitter to transmit and reflect selected beams onto the wafer surface.
Abstract:
A method and apparatus for handling wafers. A wafer pick moves along a horizontal x-axis to unload a wafer from a cassette and position the wafer over a chuck. The chuck moves upwardly along a z-axis perpendicular to the surface of the wafer and lifts the wafer off the pick. The pick retracts through a slot in the chuck and a test probe moves along the x-axis to position itself over the wafer and chuck with reference to a calculated wafer center. The chuck then moves upwardly to engage the surface of the wafer with the probe. Wafer characteristics are tested at several test points located on a circle on the surface of the wafer by repeatedly lowering the chuck, rotating the chuck by a small amount, and raising the chuck to engage the wafer with the probe. The probe is then positioned to test another circle of points.
Abstract:
A method and apparatus for measuring the curvature of a wafer. The apparatus includes a laser head that includes multiple laser sources that each emit a laser beam, each beam having a different wavelength. A CPU selects one of the sources to emit a beam. The beam is directed through a lens within the laser head and onto a surface of a wafer. The beam is reflected from the surface of the wafer and detected by a detector. The present invention includes a motor to cause relative motion between the laser head and the wafer such that the beam scans across the surface of the wafer, relaying data to the detector and the CPU. The CPU calculates the curvature of the wafer surface using the scanned data. The CPU selects a different laser source to direct a beam having a different wavelength at the wafer surface to avoid destructive interference that may occur with previously-used wavelengths. Other embodiments include the laser sources within a carousel apparatus, and the addition of a beamsplitter to transmit and reflect selected beams onto the wafer surface.