公开(公告)号：US20230004086A1

公开(公告)日：2023-01-05

申请号：US17836536

申请日：2022-06-09

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Akiyoshi Goto ,  Masafumi Kojima ,  Kyohei Sakita

IPC: G03F7/039 ,  G03F7/038 ,  C08F220/18

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

公开(公告)号：US20200301281A1

公开(公告)日：2020-09-24

申请号：US16896708

申请日：2020-06-09

Applicant: FUJIFILM Corporation

Inventor： Yasunori Yonekuta ,  Naoya Hatakeyama ,  Tsutomu Yoshimura

IPC: G03F7/20 ,  C08F212/08 ,  G03F7/004 ,  C08F220/18 ,  C08F220/56 ,  G03F7/039 ,  G03F7/32

Abstract: A resist composition includes a resin (A) including at least one repeating unit selected from the group consisting of a repeating unit represented by General Formula (1) as defined herein and a repeating unit represented by General Formula (2) as defined herein, and a repeating unit having an acid-decomposable group.

公开(公告)号：US11687001B2

公开(公告)日：2023-06-27

申请号：US16807496

申请日：2020-03-03

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US11835849B2

公开(公告)日：2023-12-05

申请号：US18109399

申请日：2023-02-14

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US11650501B2

公开(公告)日：2023-05-16

申请号：US16807496

申请日：2020-03-03

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US20210271162A1

公开(公告)日：2021-09-02

申请号：US17314321

申请日：2021-05-07

Applicant: FUJIFILM Corporation

Inventor： Keiyu OU ,  Naohiro Tango ,  Hidenori Takahashi ,  Akiyoshi Goto ,  Takeshi Kawabata ,  Tsutomu Yoshimura

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  C08F220/28 ,  C08F220/18

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition, in which the cross-sectional shape of a pattern thus formed has excellent rectangularity and a dimensional variation of the line width of the pattern thus formed hardly occurs even over time after preparation. Furthermore, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin having a polarity that increases through decomposition by an action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a halogen-based solvent, in which a content of the halogen-based solvent is from 1 ppb by mass to 50 ppm by mass with respect to a total mass of the composition.