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    Semiconductor package and fabrication method
    2.
    发明申请
    Semiconductor package and fabrication method 审中-公开
    半导体封装及制造方法

    公开(公告)号：US20060099733A1

    公开(公告)日：2006-05-11

    申请号：US10985312

    申请日：2004-11-09

    Applicant: Frank Geefay ,  Richard Ruby

    Inventor： Frank Geefay ,  Richard Ruby

    IPC: H01L21/44

    CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/6835

    Abstract: The present invention provides a first wafer and a second wafer having a device. A separation layer is formed on the first wafer. A cap is formed on the separation layer. The cap and the second wafer are bonded using a gasket. The first wafer is separated from the cap to form the semiconductor package comprised of the cap, the gasket, and the second wafer.

    Abstract translation: 本发明提供了具有装置的第一晶片和第二晶片。 在第一晶片上形成分离层。 在分离层上形成盖。 盖和第二晶片使用垫圈结合。 第一晶片与盖分离以形成由盖，垫圈和第二晶片组成的半导体封装。

    Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
    5.
    发明申请
    Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips 审中-公开
    用于通过通孔接触接触到用于FBAR芯片的晶片级封装的盖内的偏移接触器的方法

    公开(公告)号：US20070004079A1

    公开(公告)日：2007-01-04

    申请号：US11173367

    申请日：2005-06-30

    Applicant: Frank Geefay ,  Richard Ruby

    Inventor： Frank Geefay ,  Richard Ruby

    IPC: H01L21/00 ,  H01L21/4763 ,  H01L21/44

    CPC classification number: H03H9/105 ,  H01L21/76898 ,  H03H9/10

    Abstract: A device package includes a device substrate and a cap mounted on the device substrate. The device substrate includes a contact pad. The cap defines a via with a slightly sloped sidewall through the cap, a contactor extending from an interior surface of the cap, a contactor pad over the contactor, a via pad on the interior surface of the cap over the via and coupled to the contactor pad, and a via contact over the exterior surface of the cap and in the via coupled to the via pad. The contactor is offset from the via. When the cap is mounted on the device substrate, the contactor pad on the contactor is pressed and cold welded onto the contact pad on the device substrate.

    Abstract translation: 器件封装包括器件衬底和安装在器件衬底上的帽。 器件衬底包括接触焊盘。 所述盖限定了通过所述盖具有稍微倾斜的侧壁的通孔，从所述盖的内表面延伸的接触器，所述接触器上的接触器垫，所述盖的内表面上的通孔垫在所述通孔上并且联接到所述接触器 垫，以及在盖的外表面上的通孔接触件和连接到通孔垫的通孔中。 接触器偏离通孔。 当盖安装在设备基板上时，接触器上的接触器垫被压制并冷焊在设备基板上的接触垫上。

    ACOUSTICALLY COUPLED RESONATORS HAVING RESONANT TRANSMISSION MINIMA
    6.
    发明申请
    ACOUSTICALLY COUPLED RESONATORS HAVING RESONANT TRANSMISSION MINIMA 审中-公开
    具有共振传输MINIMA的高音耦合谐振器

    公开(公告)号：US20090079520A1

    公开(公告)日：2009-03-26

    申请号：US11858237

    申请日：2007-09-20

    Applicant: Tiberiu Jamneala ,  Martha Small ,  Richard Ruby

    Inventor： Tiberiu Jamneala ,  Martha Small ,  Richard Ruby

    IPC: H03H9/58

    CPC classification number: H03H9/60 ,  H03H9/584

    Abstract: A bandpass filter includes input and output terminals, first and second acoustic resonators, and an acoustic coupling layer. The first acoustic resonator includes first and second electrodes, and a piezoelectric layer between the first and second electrodes. The first electrode of the first acoustic resonator is connected to the input terminal. The second acoustic resonator includes first and second electrodes, and a piezoelectric layer between the first and second electrodes. The acoustic coupling is provided between the second electrode of the first acoustic resonator and the first electrode of the second acoustic resonator. The output terminal is connected to the second electrode of the second acoustic resonator. A capacitor extends between the input terminal and the output terminal. The filter's frequency response includes at least two transmission zeros.

    Abstract translation: 带通滤波器包括输入和输出端子，第一和第二声谐振器以及声耦合层。 第一声​​谐振器包括第一和第二电极，以及在第一和第二电极之间的压电层。 第一声​​谐振器的第一电极连接到输入端。 第二声谐振器包括第一和第二电极，以及在第一和第二电极之间的压电层。 声耦合设置在第一声谐振器的第二电极和第二声谐振器的第一电极之间。 输出端子连接到第二声谐振器的第二电极。 电容器在输入端子和输出端子之间延伸。 滤波器的频率响应包括至少两个传输零点。

    Detecting wireless channel status from acoustic discrimination of spectral content
    7.
    发明申请
    Detecting wireless channel status from acoustic discrimination of spectral content 失效
    从频谱内容的声学辨别中检测无线信道状态

    公开(公告)号：US20070058707A1

    公开(公告)日：2007-03-15

    申请号：US11226974

    申请日：2005-09-15

    Applicant: William Trutna ,  Steven Rosenau ,  Ken Nishimura ,  Graham Flower ,  Richard Ruby ,  Michael Frank ,  Mark Unkrich

    Inventor： William Trutna ,  Steven Rosenau ,  Ken Nishimura ,  Graham Flower ,  Richard Ruby ,  Michael Frank ,  Mark Unkrich

    IPC: H04B17/00

    CPC classification number: H04W72/02 ,  H04W72/085

    Abstract: Systems and methods of detecting wireless channel status from acoustic discrimination of spectral content are described. In one aspect, a wireless system includes a spectrum analyzer, a detector, and a controller. The spectrum analyzer is operable to acoustically discriminate spectral content of an input electrical signal in multiple discrete frequency channels. The detector is operable to determine respective statuses of the frequency channels from the acoustically discriminated spectral content. The controller is operable to select one of the frequency channels based on the determined statuses of the frequency channels.

    Abstract translation: 描述了从频谱内容的声学鉴别中检测无线信道状态的系统和方法。 一方面，无线系统包括频谱分析仪，检测器和控制器。 频谱分析仪可用于在多个离散频道中声学地区分输入电信号的频谱含量。 检测器可操作以从声学鉴别的频谱内容确定频道的各自状态。 控制器可操作以基于所确定的频率信道的状态来选择一个频率信道。

    Oscillatory circuit having two oscillators
    8.
    发明申请
    Oscillatory circuit having two oscillators 审中-公开
    振荡电路有两个振荡器

    公开(公告)号：US20070057734A1

    公开(公告)日：2007-03-15

    申请号：US11223425

    申请日：2005-09-09

    Applicant: Richard Ruby

    Inventor： Richard Ruby

    IPC: H03L7/00

    CPC classification number: H03L1/027 ,  H03L1/028

    Abstract: An oscillatory circuit. The oscillatory circuit includes a first oscillator, a second oscillator, and a mixer circuit. The first oscillator is configured to generate a first oscillating signal at a first frequency and has a first frequency temperature coefficient. The second oscillator is configured to generate a second oscillating signal at a second frequency and has a second frequency temperature coefficient. The second frequency is greater than the first frequency, and the second frequency temperature coefficient is less than the first frequency temperature coefficient. The mixer circuit is configured to receive the first oscillating signal from the first oscillator, to receive the second oscillating signal from the second oscillator, and to generate a mixer signal from the first and the second oscillating signals. The mixer signal comprises a signal component at a beat frequency. The beat frequency is equal to the difference between the second frequency and the first frequency.

    Abstract translation: 振荡电路。 振荡电路包括第一振荡器，第二振荡器和混频器电路。 第一振荡器被配置为以第一频率产生第一振荡信号并且具有第一频率温度系数。 第二振荡器被配置为以第二频率产生第二振荡信号并且具有第二频率温度系数。 第二频率大于第一频率，第二频率温度系数小于第一频率温度系数。 混频器电路被配置为从第一振荡器接收第一振荡信号，以从第二振荡器接收第二振荡信号，并从第一和第二振荡信号产生混频器信号。 混频器信号包括拍频的信号分量。 节拍频率等于第二频率与第一频率之间的差。

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