公开(公告)号：US09293439B2

公开(公告)日：2016-03-22

申请号：US14567052

申请日：2014-12-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Elaine Cyr ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Marcus E. Interrante ,  Roger Lam ,  Shidong Li ,  Thomas Edward Lombardi ,  Hilton T. Toy ,  Thomas Weiss

IPC: H01L23/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/055 ,  H01L23/42 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83862 ,  H01L2924/15311

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

公开(公告)号：US09543253B2

公开(公告)日：2017-01-10

申请号：US14598258

申请日：2015-01-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

IPC: B23K1/00 ,  B23K1/20 ,  B23K31/00 ,  B23K31/02 ,  B23K37/04 ,  H01L21/00 ,  H01L23/00 ,  H01L21/66 ,  H01L21/673

CPC classification number: H01L23/562 ,  H01L21/67333 ,  H01L22/12 ,  H01L22/20 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/3511 ,  Y02P80/30

Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract translation: 一种方法，包括提供层压基板，表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置在具有调整的固定装置中，以校正水平面失真，调节位于 所述层叠基板的中心，其中所述调节接触所述层叠基板。 该方法可以进一步包括助熔层压基板，将芯片放置在层压基板上，以及将固定装置放置在回流炉中以连接芯片和层叠基板。