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    MICRO-LED ARRAY TRANSFER METHOD, MANUFACTURING METHOD AND DISPLAY DEVICE
    1.
    发明申请
    MICRO-LED ARRAY TRANSFER METHOD, MANUFACTURING METHOD AND DISPLAY DEVICE 有权

    公开(公告)号：US20210135044A1

    公开(公告)日：2021-05-06

    申请号：US16605081

    申请日：2017-04-19

    Applicant: GOERTEK INC.

    Inventor： Quanbo ZOU ,  Xiaoyang ZHANG ,  Peixuan CHEN ,  Xiangxu FENG ,  Tao GAN ,  Zhe WANG

    IPC: H01L33/00 ,  H01L25/075

    Abstract: It is disclosed a micro-LED transfer method, manufacturing method and display device. The method for transferring a micro-LED array comprises: patterning conductive resist on a receiving substrate to cover electrodes for the micro-LED array to be transferred; bonding the micro-LED array on a first substrate with the receiving substrate through the conductive resist, wherein the first substrate is laser transparent; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate. According to an embodiment, the performance of a micro-LED device may be improved.

    A SILICON MICROPHONE WITH HIGH-ASPECT-RATIO CORRUGATED DIAPHRAGM AND A PACKAGE WITH THE SAME
    3.
    发明申请
    A SILICON MICROPHONE WITH HIGH-ASPECT-RATIO CORRUGATED DIAPHRAGM AND A PACKAGE WITH THE SAME 有权
    具有高比例矫正膜片的硅胶片及其相关包装

    公开(公告)号：US20170055081A1

    公开(公告)日：2017-02-23

    申请号：US15119116

    申请日：2014-07-15

    Applicant: GOERTEK INC.

    Inventor： Quanbo ZOU ,  Zhe WANG

    IPC: H04R7/14 ,  H04R1/04 ,  B81B3/00 ,  H04R19/04

    CPC classification number: H04R7/14 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/019 ,  B81C1/0023 ,  B81C2201/115 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15192 ,  H04R1/04 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003 ,  H04R2307/027 ,  H01L2924/00014

    Abstract: The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80° to 100°. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

    Abstract translation: 本发明提供一种具有高纵横比的波纹状隔膜的硅麦克风和包括该硅麦克风的麦克风封装。 麦克风包括波纹膜片，在该波纹膜片上，在隔膜的边缘附近形成有至少一个环形波纹，该波纹膜片固定到基底上，波纹膜片是柔性的，其中波纹深度与 隔膜的厚度大于5:1，优选为20:1，并且波纹壁相对于隔膜的表面以80°至100°的范围内的角度倾斜。 具有高纵横比波纹膜片的麦克风可以实现一致和最佳的灵敏度，并且在跌落测试中大大降低了对其的影响，从而可以提高性能，再现性，可靠性和产量。 本发明的麦克风封装还提供简化的处理，改进的灵敏度和改进的SNR。

    ANTI-IMPACT SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME
    4.
    发明申请
    ANTI-IMPACT SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME 有权
    基于硅胶的MEMS微型麦克风，系统及其包装

    公开(公告)号：US20160212542A1

    公开(公告)日：2016-07-21

    申请号：US14395787

    申请日：2013-08-06

    Applicant: GOERTEK INC.

    Inventor： Zhe WANG

    IPC: H04R7/16 ,  H04R19/04 ,  H04R19/00

    CPC classification number: H04R7/16 ,  H04R19/005 ,  H04R19/04 ,  H04R2307/023

    Abstract: The present invention relates to an anti-impact silicon based MEMS microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more T-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser.

    Abstract translation: 本发明涉及一种抗冲击硅基MEMS麦克风，一种系统及其封装，麦克风包括：在其中设置有后孔的硅基板; 支撑在硅衬底上并配置在其后孔上方的柔性膜片; 设置在隔膜上方的穿孔背板，其间夹有气隙，并且还在其中设置有一个或多个第一通孔; 以及止动机构，其包括一个或多个对应于所述一个或多个第一通孔的T形挡块，每个所述一个或多个第一通孔具有穿过其对应的第一通孔并连接到所述隔膜的下部， 穿孔背板并自由垂直移动，其中隔膜和多孔背板用于形成可变冷凝器的电极板。

    IMAGE DISPLAY DEVICE AND ITS MANUFACTURE METHOD
    7.
    发明申请
    IMAGE DISPLAY DEVICE AND ITS MANUFACTURE METHOD 审中-公开

    公开(公告)号：US20200175916A1

    公开(公告)日：2020-06-04

    申请号：US16615068

    申请日：2017-05-31

    Applicant: GOERTEK INC.

    Inventor： Quanbo ZOU ,  Zhe WANG ,  Xiaoyang ZHANG

    IPC: G09G3/3208 ,  H01L27/32 ,  H01L27/12 ,  G02F1/1347

    Abstract: An image display device comprises: a thin film transistor backplane (1), and a first resolution display panel (2), a second resolution display panel (4), a display driving chip (3) and an integrated display driver (5), which are fixed on the thin film transistor backplane (1); the display driving chip (3) is electrically connected to bonding pads (111) on the thin film transistor backplane (1), and is provided under the second resolution display panel (4); and the display driving chip (3) is used for driving the second resolution display panel (4); the integrated display driver (5) is used for driving the first resolution display panel (2); and a resolution of the first resolution display panel (2) is lower than a resolution of the second resolution display panel (4). The first resolution display panel (2) is driven by the standard drive manner of thin film transistor display panels, to realize low resolution displaying, and the second resolution display panel (4) is driven by the display driving chip (3), to improve the displaying quality of the display device.

    LASER PROJECTION DEVICE AND LASER PROJECTION SYSTEM
    8.
    发明申请
    LASER PROJECTION DEVICE AND LASER PROJECTION SYSTEM 有权

    公开(公告)号：US20210136334A1

    公开(公告)日：2021-05-06

    申请号：US16487246

    申请日：2017-03-07

    Applicant: GOERTEK INC.

    Inventor： Zhe WANG ,  Xiaoyang ZHANG ,  Quanbo ZOU

    IPC: H04N9/31

    Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.

    METHOD FOR MANUFACTURING THERMAL BIMORPH DIAPHRAGM AND MEMS SPEAKER WITH THERMAL BIMORPHS
    9.
    发明申请
    METHOD FOR MANUFACTURING THERMAL BIMORPH DIAPHRAGM AND MEMS SPEAKER WITH THERMAL BIMORPHS 有权
    用热二极管制造热二极管膜和MEMS扬声器的方法

    公开(公告)号：US20170041719A1

    公开(公告)日：2017-02-09

    申请号：US15305089

    申请日：2014-08-26

    Applicant: GOERTEK INC.

    Inventor： Quanbo ZOU ,  Zhe WANG ,  Jifang TAO ,  Guanxun QIU

    IPC: H04R19/02 ,  B81C1/00 ,  B81B7/00 ,  H04R31/00

    CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

    Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

    Abstract translation: 本发明提供了一种制造具有热双压电晶片的热双压电晶片和MEMS扬声器的方法，其中该方法包括以下步骤：对衬底进行热氧化以在其上获得绝缘层并在绝缘层上提供金属层; 在所述金属层上提供牺牲层; 在牺牲层上提供第一热双压电晶片; 在第一热双压电晶片层上提供第二热双压电晶片层; 在不设置牺牲层的金属层上的位置提供金属连接层; 在基板和绝缘层上形成相应的后孔并释放牺牲层; 在牺牲层被释放之后形成与第一热双压电晶片层和第二热双压电晶片层翘曲的热双压电晶片。

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