-
1.发明授权Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 有权与氧化铝基底和铂填充通孔用于有源可植入医疗器械的共烧密封馈通公开(公告)号：US09492659B2
公开(公告)日：2016-11-15
申请号：US14182569
申请日：2014-02-18
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC: H01R43/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
-
2.发明申请EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权电磁干扰过滤共同连接的传播途径，有源可插拔医疗设备的有用电容器和引线组件公开(公告)号：US20160008595A1
公开(公告)日：2016-01-14
申请号：US14864959
申请日：2015-09-25
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Steven W. Winn , Christine A. Frysz , Richard L. Brendel , Jason Woods , Dominick J. Frustaci , Xiaohong Tang , William C. Thiebolt
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。
-
3.发明授权RF filter for an active medical device (AMD) for handling high RF power induced in an associated implanted lead from an external RF field 有权用于处理来自外部RF场的相关植入引线中感应的高RF功率的有源医疗器件（AMD）的RF滤波器公开(公告)号：US09014808B2
公开(公告)日：2015-04-21
申请号：US14187297
申请日：2014-02-23
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Robert S. Johnson , Dominick J. Frustaci , Warren S. Dabney , Keith W. Seitz , Thomas Marzano , John E. Roberts , William C. Thiebolt , Christopher M. Williams , Buehl E. Truex
CPC classification number: A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。
-
4.发明授权Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device 有权适用于在有源可植入医疗装置的体液侧的电导体侧面附接的高密封气动穿通绝缘体公开(公告)号：US08938309B2
公开(公告)日：2015-01-20
申请号：US13742781
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Buehl E. Truex , Donald Hickel, Jr.
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。
-
5.发明申请公开(公告)号：US20130184796A1
公开(公告)日：2013-07-18
申请号：US13742781
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Buehl E. Truex , Donald Hickel, Jr.
IPC: A61N1/05
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。
-
Patent Agency Ranking
6.发明授权公开(公告)号：US10449375B2
公开(公告)日：2019-10-22
申请号：US15844683
申请日：2017-12-18
Applicant: Greatbatch Ltd.
Inventor： Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC: A61N1/375 , H01G4/35 , H01R13/7195 , H01G2/22 , H01G2/10 , A61N1/08 , H01G4/40 , A61N1/05 , H05K1/02
Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
-
公开(公告)号：US09687662B2
公开(公告)日：2017-06-27
申请号：US14797123
申请日：2015-07-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
-
公开(公告)号：US09071221B1
公开(公告)日：2015-06-30
申请号：US14669041
申请日：2015-03-26
Applicant: GREATBATCH LTD.
Inventor： Robert A. Stevenson , Robert Shawn Johnson , Kishore Kumar Kondabatni , Joseph E. Spaulding , Dominick J. Frustaci , Warren S. Dabney , Holly Noelle Moschiano
CPC classification number: H03H7/0123 , A61B5/042 , A61B5/055 , A61B18/1492 , A61B2018/00839 , A61B2090/374 , A61B2562/182 , A61B2562/222 , A61B2562/227 , A61N1/05 , A61N1/08 , A61N1/086 , A61N1/3718 , H03H1/0007 , H03H2001/0021 , H03H2007/013
Abstract: A composite RF current attenuator for a medical lead includes a conductor having a distal electrode contactable to biological cells, a bandstop filter in series with the lead conductor for attenuating RF currents flow through the lead conductor at a selected center frequency or across a range of frequencies about the center frequency, and a lowpass filter in series with the bandstop filter and forming a portion of the lead conductor. The bandstop filter has a capacitance in parallel with a first inductance. In a preferred form, the lowpass filter includes a second inductance in series with the bandstop filter, wherein the values of capacitance and inductances for the composite RF current attenuator are selected such that it attenuates MRI-induced RF current flow in an MRI environment.
Abstract translation: 用于医用引线的复合RF电流衰减器包括具有可与生物细胞接触的远端电极的导体，与引线导体串联的带阻滤波器，用于衰减RF电流以选定的中心频率或跨频率范围流过引线导体 关于中心频率，以及与带阻滤波器串联的低通滤波器，并形成引线导体的一部分。 带阻滤波器具有与第一电感并联的电容。 在优选形式中，低通滤波器包括与带阻滤波器串联的第二电感，其中复合RF电流衰减器的电容值和电感值被选择为使其在MRI环境中衰减MRI诱导的RF电流。
-
9.发明申请公开(公告)号：US20180178017A1
公开(公告)日：2018-06-28
申请号：US15894239
申请日：2018-02-12
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/372 , A61N1/375 , B22F2998/10 , C22C29/12 , H01G2/103 , H01G4/35 , H01R43/00 , Y10T156/1052 , B22F1/0059 , B22F3/10
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
-
10.发明申请公开(公告)号：US20180178016A1
公开(公告)日：2018-06-28
申请号：US15844683
申请日：2017-12-18
Applicant: Greatbatch Ltd.
Inventor： Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC: A61N1/375 , H01G4/35 , H01R13/7195 , H01G2/22 , H05K1/02 , A61N1/05 , H01G2/10 , A61N1/08 , H01G4/40
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , H01G2/103 , H01G2/22 , H01G4/35 , H01G4/40 , H01R13/7195 , H01R2201/12 , H05K1/0231 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
-
-
-
-
-
-
-
-
-
Search Results
31
records
(took 0.018 seconds)
