公开(公告)号：US20250096142A1

公开(公告)日：2025-03-20

申请号：US18368152

申请日：2023-09-14

Applicant: GlobalFoundries U.S. Inc.

Inventor： Jae Kyu Cho

IPC: H01L23/538 ,  G02B6/12 ,  G02B6/122 ,  G02B6/43 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Structures including an electro-optic bridge chip and methods of forming such structures. The structure comprises a photonics chip and an electro-optic bridge chip on a package substrate. The electro-optic bridge chip includes a waveguide core and an electrical trace line. A portion of the waveguide core is coupled to an optical coupler of the photonics chip.

公开(公告)号：US20220291464A1

公开(公告)日：2022-09-15

申请号：US17196428

申请日：2021-03-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Frank Kuechenmeister ,  John J. Ellis-Monaghan ,  Michal Rakowski

IPC: G02B6/42 ,  G02B6/13 ,  F21V8/00 ,  G02B6/122

Abstract: Structures including an edge coupler and a crackstop, as well as methods of forming a structure including an edge coupler and a crackstop. A waveguide core and a crackstop are located over a top surface of a dielectric layer. A communication passageway is either optically coupled or electrically coupled to the waveguide core. The communication passageway, which may include an electric conductor or a buried waveguide core, extends laterally beneath the crackstop.

公开(公告)号：US20220308297A1

公开(公告)日：2022-09-29

申请号：US17209416

申请日：2021-03-23

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  John J. Ellis-Monaghan ,  Frank G. Kuechenmeister ,  Jae Kyu Cho ,  Michal Rakowski

IPC: G02B6/42 ,  H01L23/00

Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.

公开(公告)号：US11740418B2

公开(公告)日：2023-08-29

申请号：US17209416

申请日：2021-03-23

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  John J. Ellis-Monaghan ,  Frank G. Kuechenmeister ,  Jae Kyu Cho ,  Michal Rakowski

IPC: G02B6/42 ,  H01L23/00 ,  G02B6/30 ,  G02B6/12

CPC classification number: G02B6/4248 ,  G02B6/30 ,  H01L23/562 ,  G02B2006/12119

Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.

公开(公告)号：US11569180B2

公开(公告)日：2023-01-31

申请号：US17400847

申请日：2021-08-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/522 ,  H01L31/02 ,  H01L33/62 ,  H01L23/00

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

公开(公告)号：US11543606B2

公开(公告)日：2023-01-03

申请号：US17196428

申请日：2021-03-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Frank Kuechenmeister ,  John J. Ellis-Monaghan ,  Michal Rakowski

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/13 ,  F21V8/00

Abstract: Structures including an edge coupler and a crackstop, as well as methods of forming a structure including an edge coupler and a crackstop. A waveguide core and a crackstop are located over a top surface of a dielectric layer. A communication passageway is either optically coupled or electrically coupled to the waveguide core. The communication passageway, which may include an electric conductor or a buried waveguide core, extends laterally beneath the crackstop.

公开(公告)号：US20250076575A1

公开(公告)日：2025-03-06

申请号：US18241289

申请日：2023-09-01

Applicant: GlobalFoundries U.S. Inc.

Inventor： Jae Kyu Cho ,  Norman Robson

IPC: G02B6/122 ,  G02B6/13 ,  H01L21/56 ,  H01L23/00 ,  H01L25/16

Abstract: Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core includes a portion that overlaps with the optical coupler, and the waveguide core comprises a polymer.

公开(公告)号：US20210375788A1

公开(公告)日：2021-12-02

申请号：US17400847

申请日：2021-08-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/00 ,  H01L23/522 ,  H01L31/02 ,  H01L33/62

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

公开(公告)号：US11145606B1

公开(公告)日：2021-10-12

申请号：US16830543

申请日：2020-03-26

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/00 ,  H01L23/522 ,  H01L31/02 ,  H01L33/62

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.