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公开(公告)号：US11853134B2
公开(公告)日：2023-12-26
申请号：US17498925
申请日：2021-10-12
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Vincent W. Michna , David S. Chialastri , Nilashis Dey , Yasir Jamal
CPC classification number: G06F1/20 , G06F1/183 , H05K7/20254 , G06F2200/201 , H05K7/20272
Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.
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公开(公告)号：US11304344B2
公开(公告)日：2022-04-12
申请号：US16528423
申请日：2019-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Nilashis Dey , Peter Hansen
IPC: H05K7/20 , H04L67/125 , H05K7/14
Abstract: A device that is communicating with other devices via a common bus discovers addresses of the other devices. The device transmits data to the other devices at a transmit time determined based on the addresses of the other devices. The device predicts receive times at which data will be received from the other devices and determines the transmit time based on predicted receive times, avoiding data collisions. The devices may include universal sensor data acquisition devices (“USDADs”) that are each connectable to different types of sensors arranged within a server rack. Each USDAD determines a type of a connected sensor that is within a server rack and collects sensor data from the connected sensor.
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公开(公告)号：US20200245503A1
公开(公告)日：2020-07-30
申请号：US16258887
申请日：2019-01-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Chialastri , Travis J. Gaskill , Vincent W. Michna , Nilashis Dey , Patrick Raymond
Abstract: A method for balancing air flow impedance within an enclosure. The method includes determining a configuration of each hardware module of a plurality of hardware modules arranged in a housing of the enclosure. The method also includes determining impedance settings for a plurality of adjustable air flow impedance elements within the housing, based at least in part on the configurations of the plurality of hardware modules, that will balance air flow impedances of the plurality of hardware modules. The method further includes setting the plurality of adjustable air flow impedance elements according to the determined impedance settings.
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公开(公告)号：US12111706B2
公开(公告)日：2024-10-08
申请号：US18330578
申请日：2023-06-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Scott Chialastri , Vincent W. Michna , Nilashis Dey , Yasir Jamal
CPC classification number: G06F1/206 , G06F1/26 , G06F11/3058
Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.
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公开(公告)号：US20230109810A1
公开(公告)日：2023-04-13
申请号：US17499393
申请日：2021-10-12
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Scott Chialastri , Vincent W. Michna , Nilashis Dey , Yasir Jamal
Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.
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Patent Agency Ranking
公开(公告)号：US20230074993A1
公开(公告)日：2023-03-09
申请号：US17466762
申请日：2021-09-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Vincent W. Michna , Nilashis Dey
Abstract: Example implementations relate to a power control system for controlling transmission of power from one or more power supply devices to one or more loads of a modular server enclosure. The power control system includes an electronic fuse and a threshold control unit. The electronic fuse is connected between one or more loads and the one or more power supply devices of the modular server enclosure. The threshold control unit is connected to the electronic fuse and to the one or more power supply devices. The threshold control circuit dynamically adjusts a threshold current for the electronic fuse based on a power supply capacity of the one or more power supply devices. The electronic fuse controls the transmission of the power from the one or more power supply devices to the one or more loads based on threshold current and a load current drawn by the one or more loads.
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公开(公告)号：US11709529B2
公开(公告)日：2023-07-25
申请号：US17499393
申请日：2021-10-12
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Scott Chialastri , Vincent W. Michna , Nilashis Dey , Yasir Jamal
CPC classification number: G06F1/206 , G06F1/26 , G06F11/3058
Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.
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公开(公告)号：US20210037680A1
公开(公告)日：2021-02-04
申请号：US16528423
申请日：2019-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Nilashis Dey , Peter Hansen
Abstract: A device that is communicating with other devices via a common bus discovers addresses of the other devices. The device transmits data to the other devices at a transmit time determined based on the addresses of the other devices. The device predicts receive times at which data will be received from the other devices and determines the transmit time based on predicted receive times, avoiding data collisions. The devices may include universal sensor data acquisition devices (“USDADs”) that are each connectable to different types of sensors arranged within a server rack. Each USDAD determines a type of a connected sensor that is within a server rack and collects sensor data from the connected sensor.
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公开(公告)号：US10785874B2
公开(公告)日：2020-09-22
申请号：US16245457
申请日：2019-01-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Nilashis Dey
Abstract: A technique includes coupling a resistor network to a plurality of card edge connectors. The resistor network has a resistance, and each card edge connector includes electrical contacts to couple a resistor of a circuit card assembly, when inserted into the card edge connector, to the resistor network to alter the resistance of the resistor network. The technique includes determining a state of the plurality of card edge connectors based on a signal that is provided by the resistor network.
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公开(公告)号：US20200100380A1
公开(公告)日：2020-03-26
申请号：US16139261
申请日：2018-09-24
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Vincent W. Michna , Nilashis Dey , Charles Cornwell , David Chialastri
Abstract: Examples described herein include a backplane keying mechanism. The backplane keying mechanism may include a backplane, a first connector, a second connector, a first block for the first connector, and a second block for the second connector. The first block and the second block may be moveable as one unit on the backplane from a first state to a second state. In the first state, the first block allows the first connect to connect to a first type of device and the second block allows the second connector to connect to the first type of device. In the second state, the first block prohibits the first connector from connecting to the first type of device and the second block prohibits the second connector from connecting to the first type of device.
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