Reflective mask blank, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US11880130B2

    公开(公告)日:2024-01-23

    申请号:US17946709

    申请日:2022-09-16

    CPC classification number: G03F1/24 G03F1/26

    Abstract: Provided are a reflective mask blank, having a phase shift film having little dependence of phase difference and reflectance on film thickness, and a reflective mask. The reflective mask blank is characterized in that the phase shift film is composed of a material comprised of an alloy having two or more types of metal so that reflectance of the surface of the phase shift film is more than 3% to not more than 20% and so as to have a phase difference of 170 degrees to 190 degrees, and when a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k>α*n+β is defined as Group A and a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k

    Reflective mask blank, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US11003068B2

    公开(公告)日:2021-05-11

    申请号:US16490018

    申请日:2018-02-20

    Abstract: Provided are a reflective mask blank, having a phase shift film having little dependence of phase difference and reflectance on film thickness, and a reflective mask. The reflective mask blank is characterized in that the phase shift film is composed of a material comprised of an alloy having two or more types of metal so that reflectance of the surface of the phase shift film is more than 3% to not more than 20% and so as to have a phase difference of 170 degrees to 190 degrees, and when a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k>α*n+β is defined as Group A and a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k

    Substrate with multilayer reflective film, reflective mask blank for EUV lithography, method of manufacturing reflective mask for EUV lithography and method of manufacturing semiconductor device
    6.
    发明授权
    Substrate with multilayer reflective film, reflective mask blank for EUV lithography, method of manufacturing reflective mask for EUV lithography and method of manufacturing semiconductor device 有权
    具有多层反射膜的基板,用于EUV光刻的反射掩模板,用于EUV光刻的反射掩模的制造方法和半导体器件的制造方法

    公开(公告)号:US09383637B2

    公开(公告)日:2016-07-05

    申请号:US14373715

    申请日:2013-03-21

    Abstract: An object of the present invention is to provide a substrate with a multilayer reflective film and the like used in the manufacturing of a reflective mask blank for EUV lithography which is to be subjected to dry etching with a Cl-based gas, wherein in the substrate with the multilayer reflective film, the loss of protective films by the dry etching and subsequent wet cleaning is very limited. The present invention is a substrate with a multilayer reflective film used in the manufacturing of a reflective mask blank for EUV lithography, comprising a substrate, a multilayer reflective film disposed on the substrate to reflect EUV light, and a protective film disposed on the multilayer reflective film to protect the multilayer reflective film, the protective film includes an alloy containing at least two metals, the alloy being an all-proportional solid solution.

    Abstract translation: 本发明的目的是提供一种用于制造用于EUV光刻的反射掩模坯料的多层反射膜等的衬底,其将用Cl基气体进行干蚀刻,其中在衬底 通过多层反射膜,通过干蚀刻和随后的湿法清洁的保护膜的损失非常有限。 本发明是一种具有用于制造用于EUV光刻的反射掩模板的多层反射膜的基板,包括基板,设置在基板上以反射EUV光的多层反射膜以及设置在多层反射层上的保护膜 膜保护多层反射膜,保护膜包括含有至少两种金属的合金,该合金是全比例的固溶体。

    Reflective mask blank, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US11480867B2

    公开(公告)日:2022-10-25

    申请号:US17227655

    申请日:2021-04-12

    Abstract: Provided are a reflective mask blank, having a phase shift film having little dependence of phase difference and reflectance on film thickness, and a reflective mask. The reflective mask blank is characterized in that the phase shift film is composed of a material comprised of an alloy having two or more types of metal so that reflectance of the surface of the phase shift film is more than 3% to not more than 20% and so as to have a phase difference of 170 degrees to 190 degrees, and when a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k>α*n+β is defined as Group A and a group of metal elements that satisfies the refractive index n and the extinction coefficient k of k

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