公开(公告)号：US20180057720A1

公开(公告)日：2018-03-01

申请号：US15805547

申请日：2017-11-07

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Akinari NAKAYAMA ,  Kenichi MURAKAMI ,  Kazuhiko SASADA ,  Masanobu YAMANOBE

IPC: C09J167/00 ,  C09J7/02 ,  C09J11/06 ,  C09J11/04 ,  C09J9/00 ,  B32B7/12 ,  B32B27/36 ,  B32B27/40 ,  B32B27/28 ,  B32B27/38

Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

公开(公告)号：US20140202737A1

公开(公告)日：2014-07-24

申请号：US14158252

申请日：2014-01-17

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Takashi AOYAMA ,  Kazuhiko SASADA ,  Hiroaki KOMATSU

IPC: C09J175/08 ,  H05K1/02 ,  C09J7/02

CPC classification number: H05K1/0298 ,  C08G18/0852 ,  C08G18/4879 ,  C08G18/8116 ,  C09J7/22 ,  C09J7/35 ,  C09J175/16 ,  C09J2203/326 ,  C09J2475/00 ,  C09J2479/086 ,  H05K3/386 ,  H05K2201/0154 ,  Y10T428/24959 ,  Y10T428/2852

Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Abstract translation: 粘合剂清漆包括100质量份包含在侧链中包含多个羟基的苯氧基树脂的组分A，2〜55质量份包含多官能异氰酸酯化合物的组分B，所述多官能异氰酸酯化合物在其分子中包含 异氰酸酯和乙烯基，丙烯酸酯基和甲基丙烯酸酯基中的至少一个，含有分子内含有多个马来酰亚胺基的马来酰亚胺化合物的成分C 5〜30质量份，和/或反应 的产物，包含沸点不高于100℃的低沸点溶剂的组分S1和包含沸点高于100℃的高沸点溶剂的组分S2。