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公开(公告)号：US09807918B2
公开(公告)日：2017-10-31
申请号：US14791726
申请日：2015-07-06
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Jie Zou , Hao Sun , Mingxing Yang
CPC classification number: H05K9/0049 , B29C45/14639 , B29K2995/0005 , B29L2031/3481 , G06F1/1656 , G06F1/182 , H05K9/0022 , H05K9/0081
Abstract: An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.
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公开(公告)号：US20200083144A1
公开(公告)日：2020-03-12
申请号：US16683287
申请日：2019-11-14
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang JIN , Yongwang XIAO , Guoping WANG , Jie Zou , Hualin LI
IPC: H01L23/427 , H01L23/552 , H01L23/373 , H01L23/367
Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号：US10481654B2
公开(公告)日：2019-11-19
申请号：US15878017
申请日：2018-01-23
Applicant: Huawei Device Co., Ltd.
Inventor： Xiangyang Yang , Linfang Jin , Hualin Li , Wenbing Tang , Jie Zou
Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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公开(公告)号：US20140102678A1
公开(公告)日：2014-04-17
申请号：US14105465
申请日：2013-12-13
Applicant: Huawei Device Co., Ltd.
Inventor： Jie Zou , Liechun Zhou , Xijie Wu , Jun Yang
IPC: H05K7/20
CPC classification number: H05K7/20 , H01M10/658 , H05K5/0213
Abstract: Embodiments of the present invention provide an apparatus with a heat insulation structure, where the apparatus includes an object to be heat-insulated and also includes a heat insulation closed layer disposed between the object to be heat-insulated and a heat source. The heat insulation structure adopted in the present invention specifically is a heat insulation closed layer, where the heat insulation closed layer performs heat insulation protection through a closed space between the object to be heat-insulated and the heat source, rather than performing heat insulation mainly through a physical material with a small heat conduction coefficient.
Abstract translation: 本发明的实施例提供了一种具有隔热结构的设备，其中该设备包括被隔热的物体，并且还包括设置在要被隔热的物体和热源之间的绝热封闭层。 本发明中采用的隔热结构具体是隔热封闭层，其中绝热封闭层通过绝热物体与热源之间的封闭空间进行绝热保护，而不是主要进行绝热 通过物理材料具有较小的导热系数。
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公开(公告)号：US20140063362A1
公开(公告)日：2014-03-06
申请号：US13960152
申请日：2013-08-06
Applicant: Huawei Device Co., LTD
IPC: G02F1/1333
CPC classification number: G02F1/13338 , G02F2001/133334 , G06F1/182 , G06F3/041 , G06F2203/04107
Abstract: An embodiment touch-control screen includes a metal frame, a liquid crystal display embedded into the metal frame, and a touch-control panel covering the liquid crystal display, where the touch-control panel includes a transparent conductive shield layer, and the transparent conductive shield layer is electrically connected to the metal frame. An embodiment mobile communications device includes the touch-control screen.
Abstract translation: 一种实施方式的触摸控制屏幕包括金属框架，嵌入金属框架中的液晶显示器和覆盖液晶显示器的触摸控制面板，其中触摸控制面板包括透明导电屏蔽层，并且透明导电 屏蔽层电连接到金属框架。 一个实施例的移动通信设备包括触摸控制屏幕。
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Patent Agency Ranking
公开(公告)号：US10756000B2
公开(公告)日：2020-08-25
申请号：US16683287
申请日：2019-11-14
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Yongwang Xiao , Guoping Wang , Jie Zou , Hualin Li
IPC: H01L23/427 , H01L23/552 , H01L23/367 , H01L23/373
Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号：US09910468B2
公开(公告)日：2018-03-06
申请号：US15127705
申请日：2014-03-21
Applicant: HUAWEI DEVICE CO., LTD.
Inventor： Xiangyang Yang , Linfang Jin , Hualin Li , Wenbing Tang , Jie Zou
CPC classification number: G06F1/203 , G06F1/1626 , H05K1/0203
Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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8.发明授权公开(公告)号：US09665166B2
公开(公告)日：2017-05-30
申请号：US14547518
申请日：2014-11-19
Applicant: HUAWEI DEVICE CO., LTD.
Inventor： Konggang Wei , Jie Zou , Qiang Xiong
CPC classification number: G06F1/3296 , G06F1/3212 , G06F1/3287 , H04W52/0264 , Y02D10/174 , Y02D70/00
Abstract: The method for adjusting a shutdown threshold voltage includes: obtaining a current voltage of a battery of an electronic device; when the current voltage is greater than or equal to a lowest shutdown threshold of the electronic device and less than or equal to a general shutdown threshold of the electronic device, obtaining at least one piece of application information of at least one application program, where an application shutdown threshold of an application program corresponding to each piece of application information of the at least one piece of application information is greater than the lowest shutdown threshold and less than or equal to the current voltage; and setting a current shutdown threshold, which is corresponding to the current voltage, of the electronic device to a maximum application shutdown threshold of at least one application shutdown threshold corresponding to the at least one application program.
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公开(公告)号：US10459572B2
公开(公告)日：2019-10-29
申请号：US15113965
申请日：2014-01-26
Applicant: Huawei Device Co., Ltd.
Inventor： Wei Di , Jie Zou , Yang Yang , Tianpeng Wang
Abstract: This application provides a touchscreen interference suppression method and apparatus, and a terminal device. In the method, when a touchscreen is in an untouched state, whether a wideband interference signal exists in the touchscreen is detected; and when the wideband interference signal exists, a detection bandwidth of a filter unit is reduced.
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公开(公告)号：US20150313045A1
公开(公告)日：2015-10-29
申请号：US14791726
申请日：2015-07-06
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Jie Zou , Hao Sun , Mingxing Yang
CPC classification number: H05K9/0049 , B29C45/14639 , B29K2995/0005 , B29L2031/3481 , G06F1/1656 , G06F1/182 , H05K9/0022 , H05K9/0081
Abstract: An electronic device includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.
Abstract translation: 电子设备包括金属构件，电路板和屏蔽构件。 通孔或槽设置在金属构件上。 屏蔽部件固定在金属部件上。 屏蔽构件包括阻挡部分和封闭部分。 阻挡部分由导电塑料材料制成。 封闭部分由金属材料或导电塑料材料制成。 阻挡部分被构造成阻挡通孔或槽。 封闭部分围绕电子部件设置。 封闭部分的一端电连接到金属部件，封闭部分的另一端电连接到电路板。 金属构件，阻挡部分，封闭部分和电路板形成屏蔽空间，并且电子部件位于屏蔽空间中。
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