公开(公告)号：US20230282549A1

公开(公告)日：2023-09-07

申请号：US17888918

申请日：2022-08-16

申请人： Hyundai Motor Company ,  Kia Corporation

发明人： Nam Sik KONG ,  Jun Hee PARK ,  Tae Hwa KIM

IPC分类号： H01L23/46 ,  H01L23/495 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/46 ,  H01L23/495 ,  H01L23/49861 ,  H01L23/3672 ,  H01L23/3121 ,  H01L21/56

摘要： A power module for a vehicle includes: a circuit board including a circuit pattern; a semiconductor chip connected to a first side of the circuit board; a lead frame disposed on the circuit board as being spaced apart from the semiconductor chip, and electrically connected to the semiconductor chip; and a cooling channel coupled to a second side of the circuit board and inserted in and jointed to a coolant flow channel of a cooler.

公开(公告)号：US20230369275A1

公开(公告)日：2023-11-16

申请号：US18226119

申请日：2023-07-25

申请人： Hyundai Motor Company ,  Kia Corporation

发明人： Tae Hwa KIM ,  Myung III YOU

IPC分类号： H01L23/00 ,  H01L23/367

CPC分类号： H01L24/29 ,  H01L24/11 ,  H01L23/3675 ,  H01L24/13 ,  H01L2224/29018

摘要： In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

公开(公告)号：US20240355705A1

公开(公告)日：2024-10-24

申请号：US18389496

申请日：2023-11-14

申请人： Hyundai Motor Company ,  Kia Corporation

发明人： Tae Hwa KIM

IPC分类号： H01L23/46

CPC分类号： H01L23/46 ,  H01L24/32 ,  H01L2224/32225

摘要： A power module includes a first board including an insulation layer, a first metal layer disposed on a first side of the insulation layer, and a second metal layer disposed on a second side of the insulation layer opposed to the first side of the insulation layer, a semiconductor chip disposed on the first metal layer, a heat dissipation plate connected to the second metal layer in a first direction, a housing connected to the heat dissipation plate to form an integral cooling channel therein, and a connecting body made of a clad metal in which a first material, which is connected to the heat dissipation plate and is disposed to face an inside of the cooling channel, and a second material, which is connected to the housing and is different from the first material, overlap each other in the first direction.

公开(公告)号：US20240353446A1

公开(公告)日：2024-10-24

申请号：US18373427

申请日：2023-09-27

申请人： Hyundai Motor Company ,  Kia Corporation

发明人： Tae Hwa KIM ,  Jin Myeong YANG ,  Je Hwan LEE

IPC分类号： G01R1/20 ,  H01C1/08 ,  H01C1/14 ,  H01L23/495 ,  H01L25/18 ,  H02M7/00

CPC分类号： G01R1/203 ,  H01C1/08 ,  H01C1/14 ,  H01L23/49575 ,  H01L25/18 ,  H02M7/003

摘要： A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.

公开(公告)号：US20240071858A1

公开(公告)日：2024-02-29

申请号：US17985693

申请日：2022-11-11

申请人： Hyundai Motor Company Seoul ,  Kia Corporation

发明人： Tae Hwa KIM ,  Suk Hyun LIM ,  Nam Sik KONG

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/495

CPC分类号： H01L23/3675 ,  H01L23/3735 ,  H01L23/40 ,  H01L23/495

摘要： A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

公开(公告)号：US20230360996A1

公开(公告)日：2023-11-09

申请号：US17971907

申请日：2022-10-24

申请人： Hyundai Motor Company ,  Kia Corporation

发明人： Suk Hyun LIM ,  Tae Hwa KIM

IPC分类号： H01L23/373 ,  H01L23/46 ,  H01L23/31

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/46 ,  H01L23/31 ,  H01L23/3735

摘要： A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.

公开(公告)号：US20210327842A1

公开(公告)日：2021-10-21

申请号：US17035430

申请日：2020-09-28

申请人： Hyundai Motor Company ,  Kia Motors Corporation

发明人： Tae Hwa KIM ,  Myung You, III

IPC分类号： H01L23/00 ,  H01L23/367

摘要： In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.