公开(公告)号：US11855014B2

公开(公告)日：2023-12-26

申请号：US17120825

申请日：2020-12-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Ming-Che Ho ,  Hung-Jui Kuo ,  Yi-Wen Wu ,  Tzung-Hui Lee

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/66 ,  H01L23/538

CPC分类号： H01L24/02 ,  H01L22/14 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/73 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0215 ,  H01L2224/02125 ,  H01L2224/02185 ,  H01L2224/02315 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/10125 ,  H01L2224/11009 ,  H01L2224/1147 ,  H01L2224/11462 ,  H01L2224/13018 ,  H01L2224/13026 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/26125 ,  H01L2224/27009 ,  H01L2224/2747 ,  H01L2224/27462 ,  H01L2224/29018 ,  H01L2224/29036 ,  H01L2224/29147 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73203 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/0215 ,  H01L2924/06 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2224/94 ,  H01L2224/27

摘要： A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.

公开(公告)号：US20140329361A1

公开(公告)日：2014-11-06

申请号：US14335660

申请日：2014-07-18

申请人： Infineon Technologies AG

发明人： Alexander Heinrich ,  Konrad Roesl ,  Oliver Eichinger

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/93 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/27426 ,  H01L2224/2745 ,  H01L2224/29018 ,  H01L2224/29019 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/8381 ,  H01L2224/83898 ,  H01L2224/83906 ,  H01L2224/93 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm2 of surface area of the first main surface and heat is applied to the solder material.

摘要翻译： 一种方法包括提供具有沉积在第一主表面上的第一主表面和焊料层的半导体芯片，其中焊料层的粗糙度至少为1μm。 将半导体芯片放置在载体上，半导体芯片的第一主表面面向载体。 将半导体芯片按第一主表面的表面积至少为1牛顿/千克的压力压在载体上，并将热量施加到焊料材料上。

公开(公告)号：US20120119367A1

公开(公告)日：2012-05-17

申请号：US12963938

申请日：2010-12-09

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/03001 ,  H01L2224/03003 ,  H01L2224/0311 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/29018 ,  H01L2224/29026 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

公开(公告)号：US20120074555A1

公开(公告)日：2012-03-29

申请号：US12893044

申请日：2010-09-29

申请人： Rick Snyder ,  Joel Philliber

发明人： Rick Snyder ,  Joel Philliber

IPC分类号： H01L23/06 ,  H01L23/20 ,  H01L23/48 ,  H01L23/04

CPC分类号： H01L24/32 ,  H01L23/10 ,  H01L2224/29018 ,  H01L2224/29023 ,  H01L2224/29034 ,  H01L2224/29084 ,  H01L2224/29144 ,  H01L2224/29166 ,  H01L2224/9202 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01022 ,  H01L2924/00

摘要： A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.

摘要翻译： 半导体封装包括：包括半导体器件的衬底; 盖，其包括设置在所述盖的表面上的密封环; 以及衬底和盖的表面之间的间隙。 密封环包括包含至少两列的胎面。

公开(公告)号：US11854936B2

公开(公告)日：2023-12-26

申请号：US18155067

申请日：2023-01-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Chun-Hui Yu ,  Jeng-Nan Hung ,  Kuo-Chung Yee ,  Po-Fan Lin

IPC分类号： H01L23/46 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L23/433

CPC分类号： H01L23/46 ,  H01L23/3157 ,  H01L23/367 ,  H01L23/433 ,  H01L24/29 ,  H01L2224/29018

摘要： A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.

公开(公告)号：US20230395524A1

公开(公告)日：2023-12-07

申请号：US17833580

申请日：2022-06-06

申请人： Intel Corporation

发明人： Eng Huat GOH ,  Jiun Hann SIR ,  Chee Kheong YOON ,  Telesphor KAMGAING ,  Min Suet LIM ,  Kavitha NAGARAJAN ,  Chu Aun LIM

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498

CPC分类号： H01L23/552 ,  H01L24/32 ,  H01L24/29 ,  H01L23/66 ,  H01L24/27 ,  H01L24/16 ,  H01L24/73 ,  H01L23/49822 ,  H01L2224/27515 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/16235 ,  H01L2224/26155 ,  H01L2224/26175 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/3511 ,  H01L2924/3025 ,  H01L2924/2027 ,  H01L2924/1421 ,  H01L2224/32237 ,  H01L2224/29018 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2924/0781

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, a stiffener is around the die and over the package substrate. In an embodiment, an electrically non-conductive underfill is around first level interconnects (FLIs) between the package substrate and the die. In an embodiment, an electrically conductive layer is around the non-conductive underfill.

公开(公告)号：US09655240B2

公开(公告)日：2017-05-16

申请号：US14437059

申请日：2013-10-23

申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

发明人： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Hitoshi Shimadu ,  Shigeki Kawaguchi ,  Tomoaki Asai

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01L23/00 ,  H05K3/34

CPC分类号： H05K1/111 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/2732 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29018 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83815 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/09427 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.

公开(公告)号：US08772908B2

公开(公告)日：2014-07-08

申请号：US13589359

申请日：2012-08-20

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L21/02 ,  H01L23/64 ,  H01L23/58

CPC分类号： H01L24/05 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/03001 ,  H01L2224/03003 ,  H01L2224/0311 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/29018 ,  H01L2224/29026 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

摘要翻译： 提供了组装和制造方法。 组件可以包括第一部件，其包括具有暴露表面的电介质区域，在由具有至少一部分沿导电表面延伸的振荡或螺旋路径的导电元件所限定的表面处的导电焊盘，以及导电接合材料 连接到导电焊盘并桥接相邻段之间的电介质表面的暴露部分。 导电焊盘可以允许第一部件与具有通过导电接合材料接合到焊盘的端子的第二部件的电互连。 导电元件的路径可以重叠或不重叠。

公开(公告)号：US08691628B2

公开(公告)日：2014-04-08

申请号：US13226152

申请日：2011-09-06

申请人： Yasuo Tane ,  Yukio Katamura ,  Atsushi Yoshimura ,  Fumihiro Iwami

发明人： Yasuo Tane ,  Yukio Katamura ,  Atsushi Yoshimura ,  Fumihiro Iwami

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/93 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/27312 ,  H01L2224/27848 ,  H01L2224/27901 ,  H01L2224/29016 ,  H01L2224/29017 ,  H01L2224/29018 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/05599

摘要： According to one embodiment, a method of manufacturing a semiconductor device, a bonding layer is formed on a first surface of a chip region of a semiconductor wafer. Semiconductor chips are singulated along a dicing region. The semiconductor chips are stacked stepwise via the bonding layer. In formation of the bonding layer of the semiconductor chip, in at least a part of a first region of the first surface not in contact with the other semiconductor chip in a stacked state, a projected section where the bonding layer is formed thicker than the bonding layer in a second region that is in contact with the other semiconductor chip is provided.

摘要翻译： 根据一个实施例，制造半导体器件的方法，在半导体晶片的芯片区域的第一表面上形成接合层。 半导体芯片沿切割区域分割。 半导体芯片经由接合层逐级层叠。 在半导体芯片的接合层的形成中，在层叠状态的第一面的第一区域的第一区域与其他半导体芯片不接触的情况下，形成接合层的突出部比形成 提供与另一半导体芯片接触的第二区域中的层。

公开(公告)号：US08432045B2

公开(公告)日：2013-04-30

申请号：US12963938

申请日：2010-12-09

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/48 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/03001 ,  H01L2224/03003 ,  H01L2224/0311 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/29018 ,  H01L2224/29026 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

摘要翻译： 提供了组装和制造方法。 组件可以包括第一部件，其包括具有暴露表面的电介质区域，在由具有至少一部分沿导电表面延伸的振荡或螺旋路径的导电元件所限定的表面处的导电焊盘，以及导电接合材料 连接到导电焊盘并桥接相邻段之间的电介质表面的暴露部分。 导电焊盘可以允许第一部件与具有通过导电接合材料接合到焊盘的端子的第二部件的电互连。 导电元件的路径可以重叠或不重叠。