公开(公告)号：US10316182B2

公开(公告)日：2019-06-11

申请号：US14974547

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Wei-Ta Yang

IPC: C08L63/10 ,  C08G59/14 ,  C08K3/36 ,  C08K5/1515 ,  H01B3/40

Abstract: A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.

公开(公告)号：US11746083B2

公开(公告)日：2023-09-05

申请号：US17138254

申请日：2020-12-30

Applicant: Industrial Technology Research Institute

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Wei-Ta Yang

IPC: C08G18/78 ,  C07C271/58 ,  C08G18/34

CPC classification number: C07C271/58 ,  C08G18/34 ,  C08G18/7812

Abstract: A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I)




wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.

公开(公告)号：US11118082B2

公开(公告)日：2021-09-14

申请号：US16232766

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Yen-Yi Chu ,  Wei-Ta Yang

IPC: C09D145/00 ,  C09D4/06 ,  H01B3/44 ,  C08F299/00

Abstract: A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.

公开(公告)号：US09477148B1

公开(公告)日：2016-10-25

申请号：US14721487

申请日：2015-05-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Wei-Ta Yang

IPC: G03F7/023 ,  C08G73/10 ,  G03F7/038

CPC classification number: G03F7/0233 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1082 ,  C08G73/1085 ,  C08G73/16 ,  C08G73/22 ,  C09D179/08 ,  G03F7/0387

Abstract: A polymer, a method for preparing the same, and a photosensitive resin composition thereof are provided. The polymer has a structure represented by Formula (I): wherein R1 is —OH, or —COOH; A1 is each A2 is independently each A3 is independently Z is —O—, —S—, —C(CH3)2-, —C(CF3)2-, m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and, the repeat units are arranged in a random fashion.