Spliced display with LED modules disposed on transparent substrate

    公开(公告)号:US11244937B2

    公开(公告)日:2022-02-08

    申请号:US16706799

    申请日:2019-12-08

    Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

    Laser uniformly machining apparatus and method

    公开(公告)号:US10705346B2

    公开(公告)日:2020-07-07

    申请号:US15410311

    申请日:2017-01-19

    Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

    LASER DRILLING APPARATUS AND LASER DRILLING METHOD OF TEMPERED GLASS
    3.
    发明申请
    LASER DRILLING APPARATUS AND LASER DRILLING METHOD OF TEMPERED GLASS 审中-公开
    激光钻孔设备和激光玻璃的钻孔方法

    公开(公告)号:US20170066680A1

    公开(公告)日:2017-03-09

    申请号:US14968902

    申请日:2015-12-15

    CPC classification number: B23K26/14 B23K26/389 B23K2103/54

    Abstract: In an embodiment, a laser drilling apparatus adapted to a tempered glass includes a laser source, a drilling unit, a gas supply source, a heater and an air supplier. The laser source provides a laser beam. The drilling unit has a zoom lens set and a laser scanner unit. The laser beam passes through the zoom lens set and the laser scanner unit. The gas supply source supplies an air flow. The heater is disposed on a flow channel of the air flow and heats up the air flow. The air supplier has a nozzle. Both the laser beam and the heated-up air flow reach an area to be machined of the tempered glass through the nozzle. In an embodiment, a laser drilling method for the tempered glass is also provided.

    Abstract translation: 在一个实施例中,适用于钢化玻璃的激光钻孔设备包括激光源,钻孔单元,气体供应源,加热器和空气供应器。 激光源提供激光束。 钻孔单元具有变焦透镜组和激光扫描器单元。 激光束通过变焦镜头组和激光扫描器单元。 供气源供应气流。 加热器设置在空气流的流动通道上并加热空气流。 空气供应商有一个喷嘴。 激光束和加热空气流都通过喷嘴到达要加工的钢化玻璃的区域。 在一个实施例中,还提供了用于钢化玻璃的激光钻孔方法。

Patent Agency Ranking