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    TSV-less die stacking using plated pillars/through mold interconnect
    2.
    发明授权
    TSV-less die stacking using plated pillars/through mold interconnect 有权

    公开(公告)号：US11296052B2

    公开(公告)日：2022-04-05

    申请号：US16639085

    申请日：2017-09-30

    Applicant: Intel Corporation

    Inventor： Preston T. Meyers ,  Javier A. Falcon ,  Shawna M. Liff ,  Joe R. Saucedo ,  Adel A. Elsherbini ,  Albert S. Lopez ,  Johanna M. Swan

    IPC: H01L25/065 ,  H01L25/00

    Abstract: A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.

    CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
    3.
    发明申请
    CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING 有权

    公开(公告)号：US20220199453A1

    公开(公告)日：2022-06-23

    申请号：US17132372

    申请日：2020-12-23

    Applicant: Intel Corporation

    Inventor： Michael J. Baker ,  Shawna M. Liff ,  Hsin-Wei Wang ,  Albert S. Lopez

    IPC: H01L21/683 ,  H01L21/67 ,  H01L23/00

    Abstract: Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.

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