公开(公告)号：US20170089865A1

公开(公告)日：2017-03-30

申请号：US14865455

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： SASHA N. OSTER ,  FERAS EID ,  INDIRA NEGI

IPC: G01N29/22 ,  G01N33/543

CPC classification number: G01N29/22 ,  G01N29/022 ,  G01N29/036 ,  G01N33/54373 ,  G01N2291/014 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2600/00

Abstract: An embodiment includes a package comprising: a cavity formed in a dielectric material; a beam in the cavity; an interconnect to couple the beam to a current source; a magnet coupled to the cavity; and a polymer, on the beam, having an affinity to an analyte; wherein (a) a vertical axis intersects the magnet, the cavity, and the beam; (b) in a first state the beam and the polymer, which is not coupled to the analyte, collectively have a first mass and resonate at a first resonant frequency when the beam conducts a first current; and (c) in a second state the beam and the polymer, which is coupled to the analyte, collectively have a second mass that is greater than the first mass and resonate at a second resonant frequency when the beam conducts a second current. Other embodiments are described herein.

公开(公告)号：US20170098594A1

公开(公告)日：2017-04-06

申请号：US15384222

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： FERAS EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20160161957A1

公开(公告)日：2016-06-09

申请号：US15019740

申请日：2016-02-09

Applicant: INTEL CORPORATION

Inventor： KYU OH LEE ,  SASHA N. OSTER ,  FERAS EID ,  SARAH HANEY

IPC: G05D16/20 ,  B81C1/00 ,  B81B3/00

CPC classification number: G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: A pressure sensor is integrated into an integrated circuit fabrication and packaging flow. In one example, a releasable layer is formed over a removable core. A first dielectric layer is formed. A metal layer is patterned to form conductive metal paths and to form a diaphragm with the metal. A second dielectric layer is formed over the metal layer and the diaphragm. A second metal layer is formed to connect with formed vias and to form a metal mesh layer over the diaphragm. The first dielectric layer is etched under the diaphragm to form a cavity and the cavity is covered to form a chamber adjoining the diaphragm.

Abstract translation: 压力传感器集成到集成电路制造和封装流程中。 在一个示例中，在可移除的核上形成可释放层。 形成第一介电层。 图案化金属层以形成导电金属路径并与金属形成隔膜。 第二电介质层形成在金属层和隔膜上。 形成第二金属层以与形成的通孔连接并在隔膜上形成金属网格层。 第一电介质层被刻蚀在隔膜下面以形成空腔，并且空腔被覆盖以形成与隔膜相邻的室。