公开(公告)号：US20240186206A1

公开(公告)日：2024-06-06

申请号：US18438450

申请日：2024-02-10

Applicant: Intel Corporation

Inventor： Satish PRATHABAN ,  Ramaswamy PARTHASARATHY ,  Biswajit PATRA ,  Tongyan ZHAI ,  Jeff KU ,  Min Suet LIM ,  Yi HUANG ,  Kai XIAO ,  Gene F. YOUNG ,  Weimin SHI

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L23/427 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0203 ,  H05K1/0262 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/15311

Abstract: Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.

公开(公告)号：US20220139843A1

公开(公告)日：2022-05-05

申请号：US17428565

申请日：2019-04-10

Applicant: INTEL CORPORATION

Inventor： Jun LU ,  Wei LIAO ,  Chen ZHANG ,  Guangying ZHANG ,  Liguang DU ,  Chuansheng LIU ,  Michael LEDDIGE ,  Weimin SHI ,  Eduardo MICHEL ,  Guillermo RENTERIA ZAMUDIO

IPC: H01L23/552 ,  H01L23/00

Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one electromagnetic interference structure attached to the electronic substrate adjacent to the at least one integrated circuit device. The at least one electromagnetic interference structure may be electrically attached to the electronic substrate with at least one resilient connector extending therebetween. In one embodiment, the at least one electromagnetic interference structure may be grounded to the electronic substrate.