公开(公告)号：US08420749B2

公开(公告)日：2013-04-16

申请号：US11817535

申请日：2006-03-01

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08F283/00 ,  C08L61/00 ,  C08L61/06 ,  B24D3/28 ,  C08G8/04 ,  C08G14/02

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-P-B-X-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂或酚醛树脂 作为环氧树脂材料。

公开(公告)号：US20090054585A1

公开(公告)日：2009-02-26

申请号：US11817535

申请日：2006-03-01

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08L63/00 ,  C08L61/06 ,  C09D163/00 ,  C08G8/04

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂 材料。

公开(公告)号：US08440781B2

公开(公告)日：2013-05-14

申请号：US12634259

申请日：2009-12-09

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08G65/48 ,  C08G65/38 ,  C08L61/00 ,  C08L61/06 ,  C08L63/00

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂 材料。

公开(公告)号：US20120095156A1

公开(公告)日：2012-04-19

申请号：US13256724

申请日：2009-08-05

申请人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

发明人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

IPC分类号： C08L61/14 ,  C08G8/32 ,  C08G8/36 ,  C07F9/6574

CPC分类号： H05K1/0326 ,  C07F9/657172 ,  C08G8/28 ,  C08G59/621 ,  C08L61/14 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511

摘要： Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

摘要翻译： 提供一种含磷酚类化合物的制造方法，其中在含磷化合物和苯酚的芳香核之间的反应中反应性相当优异; 在使用多元酚或酚醛树脂作为酚的情况下，作为环氧树脂固化剂的新型含磷酚类化合物，赋予固化物优异的耐热性; 含有新型含磷酚类化合物的固化性树脂组合物; 固化性树脂组合物的固化物; 印刷线路板; 和半导体密封材料。 在芳香核上具有烷氧基作为取代基的芳族醛（a1）与分子内具有P-H基或P-OH基的有机磷化合物（a2）反应。 然后使所得反应产物与苯酚（a3）反应。

公开(公告)号：US08703845B2

公开(公告)日：2014-04-22

申请号：US13822453

申请日：2011-09-27

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

IPC分类号： C08G59/32 ,  C08G59/62 ,  C08G59/06 ,  C08G61/02 ,  C08L63/00 ,  H01L21/56

CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。

公开(公告)号：US20130184377A1

公开(公告)日：2013-07-18

申请号：US13812972

申请日：2011-07-19

申请人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

发明人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

IPC分类号： C08L73/00

CPC分类号： C08L73/00 ,  C08G8/04 ,  C08L63/00 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.

摘要翻译： 本发明提供了一种热稳定性树脂组合物，其具有优异的流动性，并且实现了适用于近期电子元件相关材料的耐湿可靠性，并且在无卤素状态下与环境和谐相处的高阻燃性，其固化产物，半导体 使用该组合物的封装材料，以及赋予这些性能的酚醛树脂和环氧树脂。 作为必要成分，作为必要成分的热固性树脂组合物包含环氧树脂（A）和酚醛树脂（B），酚醛树脂（B）具有作为基本骨架的酚醛树脂结构，其中多个 含酚羟基的芳族骨架（ph）通过具有芳烃结构的亚烷基或亚甲基彼此键合，并且酚醛树脂结构的芳香核具有萘甲基或蒽基甲基。

公开(公告)号：US20130237639A1

公开(公告)日：2013-09-12

申请号：US13822453

申请日：2011-09-27

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

IPC分类号： C08L63/00

CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。

公开(公告)号：US08288003B2

公开(公告)日：2012-10-16

申请号：US13256724

申请日：2009-08-05

申请人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

发明人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

IPC分类号： B32B27/38 ,  C08L61/00 ,  C08L63/00 ,  C08L85/02 ,  C08G59/62 ,  C07F9/28 ,  C07F9/547 ,  H01L23/29

CPC分类号： H05K1/0326 ,  C07F9/657172 ,  C08G8/28 ,  C08G59/621 ,  C08L61/14 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511

摘要： Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

摘要翻译： 提供一种含磷酚类化合物的制造方法，其中在含磷化合物和苯酚的芳香核之间的反应中反应性相当优异; 在使用多元酚或酚醛树脂作为酚的情况下，作为环氧树脂固化剂的新型含磷酚类化合物，赋予固化物优异的耐热性; 含有新型含磷酚类化合物的固化性树脂组合物; 固化性树脂组合物的固化物; 印刷线路板; 和半导体密封材料。 在芳香核上具有烷氧基作为取代基的芳族醛（a1）与分子内具有P-H基或P-OH基的有机磷化合物（a2）反应。 然后使所得反应产物与苯酚（a3）反应。

公开(公告)号：US07718741B2

公开(公告)日：2010-05-18

申请号：US11908464

申请日：2006-03-16

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08L63/08 ,  C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US08084567B2

公开(公告)日：2011-12-27

申请号：US12615459

申请日：2009-11-10

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。