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    PROTECTED ACTIVE METAL ELECTRODE AND DEVICE WITH THE ELECTRODE
    2.
    发明申请
    PROTECTED ACTIVE METAL ELECTRODE AND DEVICE WITH THE ELECTRODE 有权
    用电极保护活性金属电极和器件

    公开(公告)号：US20140186716A1

    公开(公告)日：2014-07-03

    申请号：US14140471

    申请日：2013-12-25

    Applicant: Industrial Technology Research Institute

    Inventor： Jin-Bao Wu ,  Li-Duan Tsai ,  Jia-Jen Chang ,  Ming-Sheng Leu ,  Jenn-Yeu Hwang ,  Chun-Lung Li

    IPC: H01M4/36

    CPC classification number: H01M4/366 ,  B82Y30/00 ,  H01M4/13 ,  H01M4/38 ,  H01M4/382 ,  H01M4/483 ,  H01M4/581 ,  H01M4/624 ,  H01M4/625 ,  H01M10/0525 ,  H01M2004/021 ,  Y10S977/742 ,  Y10S977/948

    Abstract: A protected active metal electrode and a device with the electrode are provided. The protected active metal electrode includes an active metal substrate and a protection layer on a surface of the active metal substrate. The protection layer at least includes a metal thin film covering the surface of the active metal substrate and an electrically-conductive thin film covering a surface of the metal thin film. A material of the metal thin film is Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A material of the electrically-conductive thin film is selected from nitride of a metal in the metal thin film, carbide of a metal in the metal thin film, a diamond-like carbon (DLC), and a combination thereof.

    Abstract translation: 提供保护的有源金属电极和具有电极的器件。 受保护的有源金属电极在活性金属基板的表面上包括有源金属基板和保护层。 保护层至少包括覆盖有源金属基板的表面的金属薄膜和覆盖金属薄膜表面的导电薄膜。 金属薄膜的材料是Ti，V，Cr，Zr，Nb，Mo，Hf，Ta或W.导电薄膜的材料选自金属薄膜中的金属的氮化物，碳化物 金属薄膜中的金属，类金刚石碳（DLC）及其组合。

    Manufacturing method of ESD protection device
    3.
    发明授权
    Manufacturing method of ESD protection device 有权

    公开(公告)号：US11328946B2

    公开(公告)日：2022-05-10

    申请号：US17327783

    申请日：2021-05-24

    Applicant: Industrial Technology Research Institute

    Inventor： Ding-Shiang Wang ,  Jia-Jen Chang ,  Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chin-Te Shih

    IPC: H01L21/673 ,  B65G47/74 ,  C23C14/02 ,  C23C14/14 ,  C23C14/08 ,  C23C14/00 ,  C23C14/32 ,  H05F3/04

    Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 Ω/sq.

    HEAT DISSIPATION MODULE
    4.
    发明申请
    HEAT DISSIPATION MODULE 审中-公开

    公开(公告)号：US20170176117A1

    公开(公告)日：2017-06-22

    申请号：US14981970

    申请日：2015-12-29

    Applicant: Industrial Technology Research Institute

    Inventor： Jin-Bao Wu ,  Wei-Chien Tsai ,  Hao-Wen Cheng ,  Ming-Sheng Leu ,  Jia-Jen Chang ,  Hsien-Lin Hu

    IPC: F28F21/02

    CPC classification number: F28F21/02 ,  F28D2021/0029 ,  F28F2275/025 ,  H01L23/373 ,  H01L23/3737

    Abstract: A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.

    MANUFACTURING METHOD OF ESD PROTECTION DEVICE
    6.
    发明申请
    MANUFACTURING METHOD OF ESD PROTECTION DEVICE 有权

    公开(公告)号：US20210282253A1

    公开(公告)日：2021-09-09

    申请号：US17327783

    申请日：2021-05-24

    Applicant: Industrial Technology Research Institute

    Inventor： Ding-Shiang Wang ,  Jia-Jen Chang ,  Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chin-Te Shih

    IPC: H05F3/04 ,  H01L21/673 ,  B65G47/74 ,  C23C14/02 ,  C23C14/14 ,  C23C14/08 ,  C23C14/00 ,  C23C14/32

    Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 Ω/sq.

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